Polycarbonate resin composition

ABSTRACT

Provided is a polycarbonate-based resin composition including: a polycarbonate-polyorganosiloxane copolymer (A); and at least one kind of compound (B) selected from the group consisting of an antioxidant, a dye, a release agent, a light-diffusing agent, a flame retardant, a UV absorber, a silicone-based compound, an epoxy compound, and a polyether compound, wherein the polycarbonate-polyorganosiloxane copolymer (A) contains a polycarbonate block (A-1) and a polyorganosiloxane block (A-2), and satisfies the following requirements (1) to (3): (1) the content of the polyorganosiloxane block (A-2) is from more than 40 mass % to 70 mass % or less; (2) the copolymer has a viscosity-average molecular weight of from 10,000 to 23,000; and (3) the copolymer contains a specific polycarbonate block as the polycarbonate block (A-1).

TECHNICAL FIELD

The present invention relates to a polycarbonate-based resincomposition, and more specifically, to a polycarbonate-based resincomposition including a polycarbonate-polyorganosiloxane copolymer thathas flexibility and is excellent in transparency.

BACKGROUND ART

A resin molded article having flexibility, which can be bonded tovarious shapes or can be used by being deformed or processed inaccordance with various designs, has been required as a lighting coveror optical lens for a street light or the like. In such application,transparency and mechanical characteristics are required in addition tothe flexibility.

An acrylic resin has been widely investigated as such resin because ofits high transparency and optical characteristics (Patent Document 1).The acrylic resin has a drawback in that the resin is poor in mechanicalstrength, molding processability, and handleability, though the resin isexcellent in transparency and flexibility.

CITATION LIST Patent Document

-   Patent Document 1: JP 2003-277574 A

SUMMARY OF INVENTION Technical Problem

As compared to the acrylic resin, a polycarbonate-based resin isexcellent in mechanical strength and molding processability, but tendsto be poor in flexibility.

An object of the present invention is to provide a polycarbonate-basedresin composition having both of excellent flexibility and transparency.

Solution to Problem

The inventors of the present invention have found that the incorporationof a polycarbonate-polyorganosiloxane copolymer (hereinafter sometimesabbreviated as “PC-POS copolymer”) having a specific structural unit andsatisfying a specific condition can provide a polycarbonate-based resincomposition having flexibility and having excellent transparency andmechanical strength of the polycarbonate-polyorganosiloxane copolymer.

That is, the present invention relates to the following items [1] to[15].

[1] A polycarbonate-based resin composition, comprising:

a polycarbonate-polyorganosiloxane copolymer (A); and

at least one kind of compound (B) selected from the group consisting ofan antioxidant, a dye, a release agent, a light-diffusing agent, a flameretardant, a UV absorber, a silicone-based compound, an epoxy compound,and a polyether compound,

wherein the polycarbonate-polyorganosiloxane copolymer (A) contains apolycarbonate block (A-1) comprising a repeating unit represented by thefollowing general formula (I) and a polyorganosiloxane block (A-2)containing a repeating unit represented by the following general formula(II), and satisfies the following requirements (1) to (3):

(1) a content of the polyorganosiloxane block (A-2) is from more than 40mass % to 70 mass % or less;

(2) the copolymer has a viscosity-average molecular weight of from10,000 or more to 23,000 or less; and

(3) the copolymer contains, as the polycarbonate block (A-1), such apolycarbonate block that in the following general formula (I), “a” and“b” each represent 0, and X represents an isopropylidene group:

wherein R¹ and R² each independently represent a halogen atom, an alkylgroup having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6carbon atoms, X represents a single bond, an alkylene group having 1 to8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, acycloalkylene group having 5 to carbon atoms, an arylene group having 6to 12 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms,a fluorenediyl group, an arylalkylene group having 7 to 15 carbon atoms,an arylalkylidene group having 7 to 15 carbon atoms, —S—, —SO—, —SO₂—,—O—, or —CO—, R³ and R⁴ each independently represent a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms, and “a” and “b” each independently represent an integer of from 0to 4.

[2] A polycarbonate-based resin composition, comprising:

a polycarbonate-polyorganosiloxane copolymer (A); and

at least one kind of compound (B) selected from the group consisting ofan antioxidant, a dye, a release agent, a light-diffusing agent, a flameretardant, a UV absorber, a silicone-based compound, an epoxy compound,and a polyether compound,

wherein the polycarbonate-polyorganosiloxane copolymer (A) contains apolycarbonate block (A-1) comprising a repeating unit represented by thefollowing general formula (I) and a polyorganosiloxane block (A-2)containing a repeating unit represented by the following general formula(II), and

wherein the following requirements (1) to (3) are satisfied:

(1) a content of the polyorganosiloxane block (A-2) in thepolycarbonate-based resin composition is from 25 mass % or more to 70mass % or less;

(2) the polycarbonate-polyorganosiloxane copolymer (A) has aviscosity-average molecular weight of from 10,000 or more to 23,000 orless; and

(3) the copolymer contains, as the polycarbonate block (A-1), such apolycarbonate block that in the following general formula (I), “a” and“b” each represent 0, and X represents an isopropylidene group:

wherein R¹ and R² each independently represent a halogen atom, an alkylgroup having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6carbon atoms, X represents a single bond, an alkylene group having 1 to8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, acycloalkylene group having 5 to carbon atoms, an arylene group having 6to 12 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms,a fluorenediyl group, an arylalkylene group having 7 to 15 carbon atoms,an arylalkylidene group having 7 to 15 carbon atoms, —S—, —SO—, —SO₂—,—O—, or —CO—, R³ and R⁴ each independently represent a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms, and “a” and “b” each independently represent an integer of from 0to 4.

[3] The polycarbonate-based resin composition according to Item [1] or[2], wherein the polycarbonate-based resin composition comprises 0.001part by mass to 0.5 part by mass of the antioxidant, 0.00001 part bymass to 0.05 part by mass of the dye, 0.001 part by mass to 0.5 part bymass of the release agent, 0.1 part by mass to 5 parts by mass of thelight-diffusing agent, 0.001 part by mass to 20 parts by mass of theflame retardant, 0.01 part by mass to 1 part by mass of the UV absorber,0.01 part by mass to 0.25 part by mass of the silicone-based compound, 0parts by mass to 0.2 part by mass of the epoxy compound, and/or 0.2 partby mass to 1 part by mass of the polyether compound with respect to 100parts by mass of the polycarbonate-polyorganosiloxane copolymer (A).

[4] The polycarbonate-based resin composition according to any one ofItems [1] to [3], wherein a content of a unit represented by thefollowing general formula (III) in the polyorganosiloxane block (A-2) is0.1 mol % or less:

wherein R³³ and R³⁴ each independently represent a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms, R³¹ represents an alkylene group having 1 to 8 carbon atoms, analkylidene group having 2 to 8 carbon atoms, a cycloalkylene grouphaving 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15carbon atoms, an arylene group having 6 to 12 carbon atoms, afluorenediyl group, an arylalkylene group having 7 to 15 carbon atoms,or an arylalkylidene group having 7 to 15 carbon atoms, R³⁵ represents ahydrogen atom, a halogen atom, an alkyl group having 1 to 6 carbonatoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl grouphaving 6 to 12 carbon atoms, and “t” represents an average chain lengthof the polyorganosiloxane.

[5] The polycarbonate-based resin composition according to any one ofItems [1] to [4], wherein the polyorganosiloxane block (A-2) has anumber of repetitions of from 10 or more to less than 90.

[6] The polycarbonate-based resin composition according to Item [5],wherein the polyorganosiloxane block (A-2) has a number of repetitionsof from or more to 40 or less.

[7] The polycarbonate-based resin composition according to any one ofItems [1] to [6], wherein the polycarbonate-polyorganosiloxane copolymer(A) has a molecular weight distribution Mw/Mn of from 2.1 or more to 3.9or less.

[8] The polycarbonate-based resin composition according to any one ofItems [1] to [7], wherein the polycarbonate-polyorganosiloxane copolymer(A) has a weight-average molecular weight of 40,000 or less.

[9] The polycarbonate-based resin composition according to any one ofItems [1] to [8], wherein the polyorganosiloxane block (A-2) contains aunit represented by at least one of the following general formulae(II-I) to (II-III):

wherein R³ to R⁶ each independently represent a hydrogen atom, a halogenatom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and aplurality of R³, R⁴, R⁵, or R⁶ may be identical to or different fromeach other, Y represents —R⁷O—, —R⁷COO—, —R⁷NH—, —R⁷NR⁸—, —COO—, —S—,—R⁷COO—R⁹—O—, or —R⁷O—R¹⁰—O—, and a plurality of Y may be identical toor different from each other, the R⁷ represents a single bond, a linear,branched, or cyclic alkylene group, an aryl-substituted alkylene group,a substituted or unsubstituted arylene group, or a diarylene group, R⁸represents an alkyl group, an alkenyl group, an aryl group, or anaralkyl group, R⁹ represents a diarylene group, R¹⁰ represents a linear,branched, or cyclic alkylene group, or a diarylene group, B represents adivalent group derived from a diisocyanate compound, or a divalent groupderived from a dicarboxylic acid or a halide of a dicarboxylic acid, “n”represents a chain length of the polyorganosiloxane, n-1, and “p” and“q” each represent an integer of 1 or more representing the number ofrepetitions of a polyorganosiloxane unit, and a sum of “p” and “q” isn-2.

[10] The polycarbonate-based resin composition according to any one ofItems [1] to [9], wherein the polyorganosiloxane block (A-2) contains aunit represented by the following general formula (V):

wherein R³ to R⁶ and n-1 are identical to those described in the generalformulae (II-I) to (II-III), and R¹⁵ represents a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms.

[11] The polycarbonate-based resin composition according to any one ofItems [1] to [10], wherein a 2-millimeter thick plate formed of thepolycarbonate-based resin composition has a total light transmittance of75% or more, which is measured in conformity with JIS K 7361-1:1997.

[12] The polycarbonate-based resin composition according to any one ofItems [1] to [11], wherein the polycarbonate-based resin composition hasa durometer hardness of from 25 or more to 72 or less, which is measuredwith a type D durometer in conformity with JIS K 6253-3:2012.

[13] The polycarbonate-based resin composition according to any one ofItems [1] to [11], wherein the polycarbonate-based resin composition hasa durometer hardness of from 25 or more to 60 or less, which is measuredwith a type D durometer in conformity with JIS K 6253-3:2012.

[14] The polycarbonate-based resin composition according to any one ofItems [1] to [13], wherein the content of the polyorganosiloxane block(A-2) in the resin composition is from more than 40 mass % to 70 mass %or less.

[15] The polycarbonate-based resin composition according to any one ofItems [1] to [14], wherein the polycarbonate-based resin composition isfree of a polycarbonate-based resin except thepolycarbonate-polyorganosiloxane copolymer (A).

Advantageous Effects of Invention

According to the present invention, the polycarbonate-based resincomposition having both of excellent flexibility and transparency can beprovided.

DESCRIPTION OF EMBODIMENTS

Detailed description of a polycarbonate-based resin composition of thepresent invention is given below. In this description, a specificationconsidered to be preferred may be arbitrarily adopted, and it may besaid that a combination of preferred specifications is more preferred.The term “XX to YY” as used herein means “from XX or more to YY orless.”

A polycarbonate-based resin composition according to one aspect of thepresent invention comprises: a polycarbonate-polyorganosiloxanecopolymer (A); and at least one kind of compound (B) selected from thegroup consisting of an antioxidant, a dye, a release agent, alight-diffusing agent, a flame retardant, a UV absorber, asilicone-based compound, an epoxy compound, and a polyether compound,wherein the polycarbonate-polyorganosiloxane copolymer (A) contains apolycarbonate block (A-1) comprising a repeating unit represented by thefollowing general formula (I) and a polyorganosiloxane block (A-2)containing a repeating unit represented by the following general formula(II), and satisfies the following requirements (1) to (3):

(1) a content of the polyorganosiloxane block (A-2) is from more than 40mass % to 70 mass % or less;

(2) the copolymer has a viscosity-average molecular weight of from10,000 or more to 23,000 or less; and

(3) the copolymer contains, as the polycarbonate block (A-1), such apolycarbonate block that in the general formula (I), “a” and “b” eachrepresent 0, and X represents an isopropylidene group:

wherein R¹ and R² each independently represent a halogen atom, an alkylgroup having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6carbon atoms, X represents a single bond, an alkylene group having 1 to8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, acycloalkylene group having 5 to carbon atoms, an arylene group having 6to 12 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms,a fluorenediyl group, an arylalkylene group having 7 to 15 carbon atoms,an arylalkylidene group having 7 to 15 carbon atoms, —S—, —SO—, —SO₂—,—O—, or —CO—, R³ and R⁴ each independently represent a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms, and “a” and “b” each independently represent an integer of from 0to 4.

A polycarbonate-based resin composition according to another aspect ofthe present invention comprises: a polycarbonate-polyorganosiloxanecopolymer (A); and at least one kind of compound (B) selected from thegroup consisting of an antioxidant, a dye, a release agent, alight-diffusing agent, a flame retardant, a UV absorber, asilicone-based compound, an epoxy compound, and a polyether compound,wherein the polycarbonate-polyorganosiloxane copolymer (A) contains apolycarbonate block (A-1) comprising a repeating unit represented by thegeneral formula (I) and a polyorganosiloxane block (A-2) containing arepeating unit represented by the general formula (II), and wherein thefollowing requirements (1) to (3) are satisfied:

(1) a content of the polyorganosiloxane block (A-2) in thepolycarbonate-based resin composition is from 25 mass % or more to 70mass % or less;

(2) the polycarbonate-polyorganosiloxane copolymer (A) has aviscosity-average molecular weight of from 10,000 or more to 23,000 orless; and

(3) the copolymer contains, as the polycarbonate block (A-1), such apolycarbonate block that in the following general formula (I), “a” and“b” each represent 0, and X represents an isopropylidene group.

The polycarbonate block (A-1) represented by the general formula (I) isdescribed in detail. In the general formula (I), examples of the halogenatom that R¹ and R² each independently represent include a fluorineatom, a chlorine atom, a bromine atom, and an iodine atom.

Examples of the alkyl group that R¹ and R² each independently representinclude a methyl group, an ethyl group, a n-propyl group, an isopropylgroup, various butyl groups (the term “various” means that a lineargroup and all kinds of branched groups are included, and the same holdstrue for the following), various pentyl groups, and various hexylgroups. Examples of the alkoxy group that R¹ and R² each independentlyrepresent include alkoxy groups having the above-mentioned alkyl groupsas alkyl group moieties.

Examples of the alkylene group represented by X include a methylenegroup, an ethylene group, a trimethylene group, a tetramethylene group,and a hexamethylene group. Among them, an alkylene group having 1 to 5carbon atoms is preferred. Examples of the alkylidene group representedby X include an ethylidene group and an isopropylidene group. Examplesof the cycloalkylene group represented by X include a cyclopentanediylgroup, a cyclohexanediyl group, and a cyclooctanediyl group. Among them,a cycloalkylene group having 5 to 10 carbon atoms is preferred. Examplesof the arylene group represented by X include a phenylene group, anaphthylene group, and a biphenylene group. Examples of thecycloalkylidene group represented by X include a cyclohexylidene group,a 3,5,5-trimethylcyclohexylidene group, and a 2-adamantylidene group.Among them, a cycloalkylidene group having 5 to 10 carbon atoms ispreferred, and a cycloalkylidene group having 5 to 8 carbon atoms ismore preferred. Examples of the aryl moiety of the arylalkylene grouprepresented by X include aryl groups each having 6 to 14 ring-formingcarbon atoms, such as a phenyl group, a naphthyl group, a biphenylgroup, and an anthryl group. Examples of the aryl moiety of thearylalkylidene group represented by X include aryl groups each having 6to 14 ring-forming carbon atoms, such as a phenyl group, a naphthylgroup, a biphenyl group, and an anthryl group.

“a” and “b” each independently represent an integer of from 0 to 4,preferably from 0 to 2, more preferably 0 or 1. Among them, a repeatingunit in which “a” and “b” each represent 0, and X represents a singlebond or an alkylene group having 1 to 8 carbon atoms, or a repeatingunit in which “a” and “b” each represent 0, and X represents analkylidene group, in particular an isopropylidene group is suitable.

The PC-POS copolymer (A) in the polycarbonate-based resin composition ofthe present invention satisfies the following requirement (3): thecopolymer contains, as the polycarbonate block (A-1), such apolycarbonate block (hereinafter sometimes abbreviated as “BPA block”)that in the general formula (I), “a” and “b” each represent 0, and Xrepresents an isopropylidene group. The amount of the BPA block in thepolycarbonate block (A-1) is preferably 90 mass % or more, morepreferably 90.9 mass % or more, still more preferably 93.3 mass % ormore, particularly preferably 95 mass % or more, most preferably 100mass %. The amount of the BPA block preferably falls within the rangesfrom the viewpoint of the transparency of the composition.

A plurality of kinds of polycarbonate blocks may be incorporated as thepolycarbonate blocks (A-1) of the PC-POS copolymer (A) as long as theabove-mentioned requirement (3) is satisfied. When the polycarbonateblocks (A-1) include a plurality of kinds of blocks, the total amount ofthe BPA block and the other polycarbonate block becomes 100 mass %.

Next, the polyorganosiloxane block (A-2) represented by the generalformula (II) is described in detail.

In the general formula (II), examples of the halogen atom that R³ and R⁴each independently represent include a fluorine atom, a chlorine atom, abromine atom, and an iodine atom. Examples of the alkyl group that R³and R⁴ each independently represent include a methyl group, an ethylgroup, a n-propyl group, an isopropyl group, various butyl groups,various pentyl groups, and various hexyl groups. Examples of the alkoxygroup that R³ and R⁴ each independently represent include alkoxy groupshaving the above-mentioned alkyl groups as alkyl group moieties.Examples of the aryl group that R³ and R⁴ each independently representinclude a phenyl group and a naphthyl group.

R³ and R⁴ each preferably represent a hydrogen atom, an alkyl grouphaving 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms,or an aryl group having 6 to 12 carbon atoms, and each more preferablyrepresent a methyl group.

The polyorganosiloxane block (A-2) containing the repeating unitrepresented by the general formula (II) preferably has a unitrepresented by any one of the following general formulae (II-I) to(II-III):

wherein R³ to R⁶ each independently represent a hydrogen atom, a halogenatom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and aplurality of R³, R⁴, R⁵, or R⁶ may be identical to or different fromeach other, Y represents —R⁷O—, —R⁷COO—, —R⁷NH—, —R⁷NR⁸—, —COO—, —S—,—R⁷COO—R⁹—O—, or —R⁷O—R¹⁰—O—, and a plurality of Y may be identical toor different from each other, the R⁷ represents a single bond, a linear,branched, or cyclic alkylene group, an aryl-substituted alkylene group,a substituted or unsubstituted arylene group, or a diarylene group, R⁸represents an alkyl group, an alkenyl group, an aryl group, or anaralkyl group, R⁹ represents a diarylene group, R¹⁰ represents a linear,branched, or cyclic alkylene group, or a diarylene group, ß represents adivalent group derived from a diisocyanate compound, or a divalent groupderived from a dicarboxylic acid or a halide of a dicarboxylic acid, “n”represents the chain length of the polyorganosiloxane, n-1, and “p” and“q” each represent an integer of 1 or more representing the number ofrepetitions of a polyorganosiloxane unit, and the sum of “p” and “q” isn-2.

Examples of the halogen atom that R³ to R⁶ each independently representinclude a fluorine atom, a chlorine atom, a bromine atom, and an iodineatom. Examples of the alkyl group that R³ to R⁶ each independentlyrepresent include a methyl group, an ethyl group, a n-propyl group, anisopropyl group, various butyl groups, various pentyl groups, andvarious hexyl groups. Examples of the alkoxy group that R³ to R⁶ eachindependently represent include alkoxy groups having the above-mentionedalkyl groups as alkyl group moieties. Examples of the aryl group that R³to R⁶ each independently represent include a phenyl group and a naphthylgroup.

R³ to R⁶ each preferably represent a hydrogen atom, an alkyl grouphaving 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms,or an aryl group having 6 to 12 carbon atoms.

R³ to R⁶ in the general formula (II-I), the general formula (II-II),and/or the general formula (II-III) each preferably represent a methylgroup.

The linear or branched alkylene group represented by R⁷ in —R⁷O—,—R⁷COO—, —R⁷NH—, —R⁷NR⁸—, —R⁷COO—R⁹—O—, or —R⁷O—R¹⁰—O— represented by Yis, for example, an alkylene group having 1 to 8 carbon atoms,preferably 1 to 5 carbon atoms. The cyclic alkylene group is, forexample, a cycloalkylene group having 5 to 15 carbon atoms, preferably 5to 10 carbon atoms.

The aryl-substituted alkylene group represented by R⁷ may have asubstituent, such as an alkoxy group or an alkyl group, on its aromaticring, and a specific structure thereof may be, for example, a structurerepresented by the following general formula (i) or (ii). When thearyl-substituted alkylene group is present, the alkylene group is bondedto Si.

wherein “c” represents a positive integer and typically represents aninteger of from 1 to 6.

The diarylene group represented by any one of R⁷, R⁹, and R¹⁰ refers toa group in which two arylene groups are linked to each other directly orthrough a divalent organic group, and is specifically a group having astructure represented by —Ar¹—W—Ar²—. Ar¹ and Ar² each represent anarylene group, and W represents a single bond or a divalent organicgroup. Examples of the divalent organic group represented by W includean isopropylidene group, a methylene group, a dimethylene group, and atrimethylene group.

Examples of the arylene group represented by any one of R⁷, Ar¹, and Ar²include arylene groups each having 6 to 14 ring-forming carbon atoms,such as a phenylene group, a naphthylene group, a biphenylene group, andan anthrylene group. Those arylene groups may each have an arbitrarysubstituent, such as an alkoxy group or an alkyl group.

The alkyl group represented by R⁸ is a linear or branched group having 1to 8, preferably 1 to 5 carbon atoms. The alkenyl group is, for example,a linear or branched group having 2 to 8, preferably 2 to 5 carbonatoms. The aryl group is, for example, a phenyl group or a naphthylgroup. The aralkyl group is, for example, a phenylmethyl group or aphenylethyl group.

The linear, branched, or cyclic alkylene group represented by R¹⁰ is thesame as that represented by R⁷.

Y preferably represents —R⁷O—. R⁷ preferably represents anaryl-substituted alkylene group, in particular a residue of aphenol-based compound having an alkyl group, and more preferablyrepresents an organic residue derived from allylphenol or an organicresidue derived from eugenol.

With regard to “p” and “q” in the formula (II-II), it is preferred thatp=q.

ß represents a divalent group derived from a diisocyanate compound, or adivalent group derived from a dicarboxylic acid or a halide of adicarboxylic acid, and examples thereof include divalent groupsrepresented by the following general formulae (iii) to (vii).

In the PC-POS copolymer (A), it is more preferred that thepolyorganosiloxane block (A-2) contain a unit represented by thefollowing general formula (V):

wherein R³ to R⁶ and “n” are identical to those described in the generalformulae (II-I) to (II-III), and R¹⁵ represents a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms.

The number of repetitions of the polyorganosiloxane block (A-2) in thePC-POS copolymer (A) is preferably from 10 or more to less than 90, morepreferably from 10 or more to 40 or less. Specifically, the number ofrepetitions is preferably 10 or more, more preferably 15 or more, stillmore preferably 20 or more, and is preferably less than 90, morepreferably 80 or less, still more preferably 60 or less, still morepreferably 45 or less, still more preferably 40 or less, particularlypreferably less than 40.

The number of repetitions is calculated by nuclear magnetic resonance(NMR) measurement. When the number of repetitions of thepolyorganosiloxane block (A-2) is set within the above-mentioned ranges,both of excellent transparency and flexibility can be achieved, andpeeling after the production of a molded body can be suppressed.

In one aspect of the present invention, the PC-POS copolymer (A) in thepolycarbonate-based resin composition satisfies the followingrequirement (1): the content of the polyorganosiloxane block (A-2) isfrom more than 40 mass % to 70 mass % or less. When the content of thepolyorganosiloxane block (A-2) in the PC-POS copolymer (A) is set tomore than 40 mass %, a copolymer excellent in flexibility can beobtained. When the content of the polyorganosiloxane block (A-2) is 70mass % or less, a copolymer that is free of remarkable tackiness and canmaintain a shape as a flexible molded body is obtained.

The content of the polyorganosiloxane block (A-2) in the PC-POScopolymer (A) is preferably 41 mass % or more, more preferably 45 mass %or more, for example, more than 50 mass %, and is preferably 65 mass %or less, more preferably 62 mass % or less.

In another aspect of the present invention, the polycarbonate-basedresin composition satisfies the following requirement (1): the contentof the polyorganosiloxane block (A-2) in the polycarbonate-based resincomposition is from 25 mass % or more to 70 mass % or less. When thecontent of the polyorganosiloxane block (A-2) in the resin compositionis set to 25 mass % or more, a resin composition excellent inflexibility and excellent in mechanical strength can be obtained. Whenthe content of the polyorganosiloxane block (A-2) in the resincomposition is 70 mass % or less, a flexible molded body free ofremarkable tackiness can be obtained.

The content of the polyorganosiloxane block (A-2) in thepolycarbonate-based resin composition is preferably 30 mass % or more,more preferably more than 40 mass %, still more preferably 41 mass % ormore, still more preferably 45 mass % or more, for example, more than 50mass %, and is preferably 65 mass % or less, more preferably 62 mass %or less.

The PC-POS copolymer (A) further satisfies the following requirement(2): the copolymer has a viscosity-average molecular weight (Mv) of from10,000 or more to 23,000 or less. The viscosity-average molecular weight(Mv) may be adjusted by using, for example, a molecular weight modifier(terminal stopper) or by a reaction condition. When theviscosity-average molecular weight is set within the range of therequirement (2), a copolymer excellent in moldability can be obtained.

The viscosity-average molecular weight (Mv) is preferably 12,000 ormore, more preferably 14,000 or more, still more preferably 16,000 ormore, and is preferably 21,500 or less, more preferably 20,500 or less,still more preferably 19,500 or less, still more preferably 18,500 orless, particularly preferably 18,000 or less. When the viscosity-averagemolecular weight is 10,000 or more, a sufficient strength of a moldedarticle can be obtained.

The viscosity-average molecular weight (Mv) is a value calculated fromthe following Schnell's equation by measuring the limiting viscosity [η]of a methylene chloride solution at 20° C.

[η]=1.23×10⁻⁵ ×Mv ^(0.83)

The weight-average molecular weight (Mw) of the PC-POS copolymer (A) ispreferably 40,000 or less. When the weight-average molecular weight (Mw)falls within the range, a PC-POS copolymer excellent in flexibility canbe obtained. The weight-average molecular weight (Mw) of the PC-POScopolymer (A) is more preferably 37,000 or less, still more preferably35,000 or less, still more preferably 30,000 or less. In addition, theweight-average molecular weight (Mw) is preferably 20,000 or more, morepreferably 23,000 or more.

Further, the molecular weight distribution (Mw/Mn) of the PC-POScopolymer (A) is preferably from 2.1 or more to 3.9 or less. Themolecular weight distribution Mw/Mn of the PC-POS copolymer (A)preferably falls within the range because nonuniformity due to anirregular flow or phase separation at the time of the molding of thepolycarbonate-based resin composition including the PC-POS copolymer (A)is suppressed, and hence a molded body having high transparency andflexibility that is easy to control can be obtained.

The molecular weight distribution Mw/Mn of the PC-POS copolymer (A) ismore preferably 2.3 or more, still more preferably 2.4 or more, stillmore preferably 2.5 or more, still more preferably 2.7 or more,particularly preferably 2.8 or more, and is more preferably 3.5 or less,still more preferably 3.0 or less, particularly preferably 2.9 or less.

The PC-POS copolymer (A) may be produced by a known production method,such as an interfacial polymerization method (phosgene method), apyridine method, or an ester exchange method. In particular, aninterfacial polymerization method including adding a polyorganosiloxaneto a reaction system in which a dihydric phenol and a carbonateprecursor are polymerized to perform copolymerization is preferablyadopted because an organic phase containing the PC-POS copolymer and anaqueous phase containing, for example, an unreacted product or acatalyst residue can be separated from each other in an oil-waterseparation step after the polymerization, and each washing step based onalkali washing, acid washing, or pure water (ion-exchanged water)washing, and hence the PC-POS copolymer is efficiently obtained. Withregard to a method of producing the PC-POS copolymer, reference may bemade to, for example, a method described in JP 2014-80462 A.

Specifically, the PC-POS copolymer (A) may be produced by: dissolving apolycarbonate oligomer produced in advance to be described later and apolyorganosiloxane in a water-insoluble organic solvent (e.g., methylenechloride); adding a solution of a dihydric phenol-based compound (e.g.,bisphenol A) in an aqueous alkaline compound (e.g., aqueous sodiumhydroxide) to the solution; and subjecting the mixture to an interfacialpolycondensation reaction through the use of a tertiary amine (e.g.,triethylamine) or a quaternary ammonium salt (e.g.,trimethylbenzylammonium chloride) as a polymerization catalyst in thepresence of a terminal stopper (a monohydric phenol, such asp-tert-butylphenol). The PC-POS copolymer (A) may also be produced bycopolymerizing the polyorganosiloxane and a dihydric phenol, andphosgene, a carbonate ester, or a chloroformate.

When the PC-POS copolymer (A) in the polycarbonate-based resincomposition of the present invention is produced by, for example,causing a polycarbonate oligomer and a polyorganosiloxane raw materialto react with each other in an organic solvent, and then causing theresultant to react with a dihydric phenol, from the viewpoint of thetransparency of the PC-POS copolymer (A) to be obtained, the solidcontent weight (g/L) of the polycarbonate oligomer in 1 L of a mixedsolution of the organic solvent and the polycarbonate oligomerpreferably falls within the range of 200 g/L or less. The solid contentweight is more preferably 180 g/L or less, still more preferably 170 g/Lor less, still more preferably 150 g/L or less, still more preferably120 g/L or less.

The lower limit of the solid content weight (g/L) of the polycarbonateoligomer in 1 L of the mixed solution of the organic solvent and thepolycarbonate oligomer is not particularly limited because as the solidcontent weight becomes lower, the transparency of the copolymer to beobtained becomes more satisfactory. However, from the viewpoint ofefficiently producing the PC-POS copolymer, the solid content weight ispreferably 20 g/L or more, more preferably 30 g/L or more, still morepreferably 40 g/L or more.

A polyorganosiloxane represented by the following general formula (1),general formula (2), and/or general formula (3) may be used as thepolyorganosiloxane serving as a raw material:

wherein

R³ to R⁶, Y, ß, n-1, “p”, and “q” are as described above, and specificexamples and preferred examples thereof are also the same as thosedescribed above, and

Z represents a hydrogen atom or a halogen atom, and a plurality of Z maybe identical to or different from each other.

Examples of the polyorganosiloxane represented by the general formula(1) include compounds each represented by any one of the followinggeneral formulae (1-1) to (1-11):

wherein

in the general formulae (1-1) to (1-11), R³ to R⁶, “n”, and R⁸ are asdefined above, and preferred examples thereof are also the same as thosedescribed above, and “c” represents a positive integer and typicallyrepresents an integer of from 1 to 6.

Among them, a phenol-modified polyorganosiloxane represented by thegeneral formula (1-1) is preferred from the viewpoint of the ease ofpolymerization for obtaining the polyorganosiloxane. Anα,ω-bis[3-(σ-hydroxyphenyl)propyl]polydimethylsiloxane, which is onecompound represented by the general formula (1-2), or anα,ω-bis[3-(4-hydroxy-3-methoxyphenyl)propyl]polydimethylsiloxane, whichis one compound represented by the general formula (1-3), is preferredfrom the viewpoint of its ease of availability.

In addition to the foregoing, a compound having a structure representedby the following general formula (4) may be used as a polyorganosiloxaneraw material:

wherein R³ and R⁴ are identical to those described above. The averagechain length of the polyorganosiloxane block represented by the generalformula (4) is (r×m), and the range of the (r×m) is the same as that ofthe “n”.

When the compound represented by the general formula (4) is used as apolyorganosiloxane raw material, the polyorganosiloxane block (A-2)preferably has a unit represented by the following general formula(II-IV):

wherein R³, R⁴, “r”, and “m” are as described above.

The copolymer may include a structure represented by the followinggeneral formula (II-V) as the polyorganosiloxane block (A-2):

wherein R¹⁸ to R²¹ each independently represent a hydrogen atom or analkyl group having 1 to 13 carbon atoms, R²² represents an alkyl grouphaving 1 to 6 carbon atoms, a hydrogen atom, a halogen atom, a hydroxygroup, an alkoxy group having 1 to 6 carbon atoms, or an aryl grouphaving 6 to 14 carbon atoms, Q² represents a divalent aliphatic grouphaving 1 to 10 carbon atoms, and n-1 represents the number ofrepetitions of the polyorganosiloxane block and its range is asdescribed above.

In the general formula (II-V), examples of the alkyl group having 1 to13 carbon atoms that R¹⁸ to R²¹ each independently represent include amethyl group, an ethyl group, a n-propyl group, an isopropyl group,various butyl groups, various pentyl groups, various hexyl groups,various heptyl groups, various octyl groups, a 2-ethylhexyl group,various nonyl groups, various decyl groups, various undecyl groups,various dodecyl groups, and various tridecyl groups. Among them, R¹⁸ toR²¹ each preferably represent a hydrogen atom or an alkyl group having 1to 6 carbon atoms, and it is more preferred that all of R¹⁸ to R²¹ eachrepresent a methyl group.

Examples of the alkyl group having 1 to 6 carbon atoms represented byR²² include a methyl group, an ethyl group, a n-propyl group, anisopropyl group, various butyl groups, various pentyl groups, andvarious hexyl groups. Examples of the halogen atom represented by R²²include a fluorine atom, a chlorine atom, a bromine atom, and an iodineatom. An example of the alkoxy group having 1 to 6 carbon atomsrepresented by R²² is an alkoxy group whose alkyl group moiety is thealkyl group described above. Examples of the aryl group having 6 to 14carbon atoms represented by R²² include a phenyl group, a tolyl group, adimethylphenyl group, and a naphthyl group.

R²² represents preferably a hydrogen atom or an alkoxy group having 1 to6 carbon atoms, more preferably a hydrogen atom or an alkoxy grouphaving 1 to 3 carbon atoms, still more preferably a hydrogen atom amongthem.

The divalent aliphatic group having 1 to 10 carbon atoms represented byQ² is preferably a linear or branched divalent saturated aliphatic grouphaving 1 to 10 carbon atoms. The number of carbon atoms of the saturatedaliphatic group is preferably from 1 to 8, more preferably from 2 to 6,still more preferably from 3 to 6, still more preferably from 4 to 6.The number of repetitions n-1 is as described above.

A preferred mode of the constituent unit (II-V) may be, for example, astructure represented by the following general formula (II-VI):

wherein n-1 is as described above.

The polyorganosiloxane block (A-2) represented by the general formula(II-V) or (II-VI) may be obtained by using a polyorganosiloxane rawmaterial represented by the following general formula (5) or (6):

wherein R¹⁸ to R²², Q², and n-1 are as described above;

wherein n-1 is as described above.

A method of producing the polyorganosiloxane is not particularlylimited. According to, for example, a method described in JP 11-217390A, a crude polyorganosiloxane may be obtained by: causingcyclotrisiloxane and disiloxane to react with each other in the presenceof an acid catalyst to synthesize α,ω-dihydrogen organopentasiloxane;and then subjecting the α,ω-dihydrogen organopentasiloxane to anaddition reaction with, for example, a phenolic compound (e.g.,2-allylphenol, 4-allylphenol, eugenol, or 2-propenylphenol) in thepresence of a catalyst for a hydrosilylation reaction. According to amethod described in JP 2662310 B2, the crude polyorganosiloxane may beobtained by: causing octamethylcyclotetrasiloxane andtetramethyldisiloxane to react with each other in the presence ofsulfuric acid (acid catalyst); and subjecting the resultantα,ω-dihydrogen organopolysiloxane to an addition reaction with thephenolic compound or the like in the presence of the catalyst for ahydrosilylation reaction in the same manner as that described above. Theα,ω-dihydrogen organopolysiloxane may be used after its chain length “n”has been appropriately adjusted in accordance with its polymerizationconditions, or a commercial α,ω-dihydrogen organopolysiloxane may beused. Specifically, a catalyst described in JP 2016-098292 A may be usedas the catalyst for a hydrosilylation reaction.

The polycarbonate oligomer may be produced by a reaction between adihydric phenol and a carbonate precursor, such as phosgene ortriphosgene, in an organic solvent, such as methylene chloride,chlorobenzene, or chloroform. When the polycarbonate oligomer isproduced by using an ester exchange method, the oligomer may be producedby a reaction between the dihydric phenol and a carbonate precursor,such as diphenyl carbonate.

A dihydric phenol represented by the following general formula (viii) ispreferably used as the dihydric phenol:

wherein R¹, R², “a”, “b”, and X are as described above.

Examples of the dihydric phenol represented by the general formula(viii) include: bis(hydroxyphenyl)alkane-based dihydric phenols, such as2,2-bis(4-hydroxyphenyl)propane [bisphenol A],bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane, and2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane; 4,4′-dihydroxydiphenyl;bis(4-hydroxyphenyl)cycloalkanes; bis(4-hydroxyphenyl) oxide;bis(4-hydroxyphenyl) sulfide; bis(4-hydroxyphenyl) sulfone;bis(4-hydroxyphenyl) sulfoxide; and bis(4-hydroxyphenyl) ketone. Thosedihydric phenols may be used alone or as a mixture thereof.

Among them, bis(hydroxyphenyl)alkane-based dihydric phenols arepreferred, and bisphenol A is more preferred. When bisphenol A is usedas the dihydric phenol, the PC-POS copolymer is such that in the generalformula (i), X represents an isopropylidene group and a=b=0.

Examples of the dihydric phenol except bisphenol A includebis(hydroxyaryl)alkanes, bis(hydroxyaryl)cycloalkanes, dihydroxyarylethers, dihydroxydiaryl sulfides, dihydroxydiaryl sulfoxides,dihydroxydiaryl sulfones, dihydroxydiphenyls, dihydroxydiaryl fluorenes,and dihydroxydiaryl adamantanes. Those dihydric phenols may be usedalone or as a mixture thereof.

Examples of the bis(hydroxyaryl)alkanes includebis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane,2,2-bis(4-hydroxyphenyl)butane, 2,2-bis(4-hydroxyphenyl)octane,bis(4-hydroxyphenyl)phenylmethane, bis(4-hydroxyphenyl)diphenylmethane,2,2-bis(4-hydroxy-3-methylphenyl)propane,bis(4-hydroxyphenyl)naphthylmethane,1,1-bis(4-hydroxy-3-tert-butylphenyl)propane,2,2-bis(4-hydroxy-3-bromophenyl)propane,2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane,2,2-bis(4-hydroxy-3-chlorophenyl)propane,2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, and2,2-bis(4-hydroxy-3,5-dibromophenyl)propane.

Examples of the bis(hydroxyaryl)cycloalkanes include1,1-bis(4-hydroxyphenyl)cyclopentane,1,1-bis(4-hydroxyphenyl)cyclohexane,1,1-bis(4-hydroxyphenyl)-3,5,5-trimethylcyclohexane,2,2-bis(4-hydroxyphenyl)norbornane, and1,1-bis(4-hydroxyphenyl)cyclododecane. Examples of the dihydroxyarylethers include 4,4′-dihydroxydiphenyl ether and4,4′-dihydroxy-3,3′-dimethylphenyl ether.

Examples of the dihydroxydiaryl sulfides include 4,4′-dihydroxydiphenylsulfide and 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfide. Examples ofthe dihydroxydiaryl sulfoxides include 4,4′-dihydroxydiphenyl sulfoxideand 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfoxide. Examples of thedihydroxydiaryl sulfones include 4,4′-dihydroxydiphenyl sulfone and4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfone.

An example of the dihydroxydiphenyls is 4,4′-dihydroxydiphenyl. Examplesof the dihydroxydiarylfluorenes include 9,9-bis(4-hydroxyphenyl)fluoreneand 9,9-bis(4-hydroxy-3-methylphenyl)fluorene. Examples of thedihydroxydiaryladamantanes include 1,3-bis(4-hydroxyphenyl)adamantane,2,2-bis(4-hydroxyphenyl)adamantane, and1,3-bis(4-hydroxyphenyl)-5,7-dimethyladamantane.

Examples of dihydric phenols except those described above include4,4′-[1,3-phenylenebis(1-methylethylidene)]bisphenol,10,10-bis(4-hydroxyphenyl)-9-anthrone, and1,5-bis(4-hydroxyphenylthio)-2,3-dioxapentane.

In order to adjust the molecular weight of the PC-POS copolymer to beobtained, a terminal stopper (molecular weight modifier) may be used.Examples of the terminal stopper may include monohydric phenols, such asphenol, p-cresol, p-tert-butylphenol, p-tert-octylphenol, p-cumylphenol,p-nonylphenol, m-pentadecylphenol, and p-tert-amylphenol. Thosemonohydric phenols may be used alone or in combination thereof.

After the interfacial polycondensation reaction, the PC-POS copolymer(A) may be obtained by appropriately leaving the resultant at rest toseparate the resultant into an aqueous phase and an organic solventphase [separating step], washing the organic solvent phase (preferablywashing the phase with a basic aqueous solution, an acidic aqueoussolution, and water in the stated order) [washing step], concentratingthe resultant organic phase [concentrating step], and drying theconcentrated phase [drying step].

In the PC-POS copolymer (A), a content of a unit represented by thefollowing general formula (III) in the polyorganosiloxane block (A-2) ispreferably 0.1 mol % or less:

wherein R³³ and R³⁴ each independently represent a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms, R³¹ represents an alkylene group having 1 to 8 carbon atoms, analkylidene group having 2 to 8 carbon atoms, a cycloalkylene grouphaving 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15carbon atoms, an arylene group having 6 to 12 carbon atoms, afluorenediyl group, an arylalkylene group having 7 to 15 carbon atoms,or an arylalkylidene group having 7 to 15 carbon atoms, R³⁵ represents ahydrogen atom, a halogen atom, an alkyl group having 1 to 6 carbonatoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl grouphaving 6 to 12 carbon atoms, and “t” represents an average chain lengthof the polyorganosiloxane.

When the content of the block represented by the general formula (III)is 0.1 mol % or less, precise control can be performed between the rawmaterial polyorganosiloxane to be used at the time of the production ofthe PC-POS copolymer and the chain length of the copolymer, and hencethe PC-POS copolymer (A) having both of high flexibility andtransparency serving as objects can be obtained.

Specifically, the adoption of the above-mentioned interfacialpolymerization method can provide a PC-POS copolymer in which thecontent of the block represented by the general formula (III) becomes0.1 mol % or less. The block represented by the general formula (III)may not be theoretically incorporated into the PC-POS copolymer (A) inview of its synthesis procedure, and hence its content is substantially0.0 mol %.

A method of quantifying the content of the block represented by thegeneral formula (III) in the PC-POS copolymer (A) is described indetail. The content of the block represented by the general formula(III) in the PC-POS copolymer (A) is quantified by a peak of ¹³C-NMR. Aspecific quantification method is described in Examples. Thequantification lower limit of the quantification method is less than 0.1mol % on the basis of the SN ratio of the baseline of a ¹³C-NMR chart.Although quantification is impossible in a region of less than 0.1 mol%, semi-quantification is possible. At the time of thesemi-quantification, relative comparison between the heights of peakseach corresponding to the block represented by the general formula (III)is performed. When it is difficult to perform the relative comparisonbetween the peak heights, the lower limit at which thesemi-quantification can be performed can be further lowered by furtherincreasing the number of scans to increase the SN ratio.

The content of the block represented by the general formula (III) in thePC-POS copolymer (A) identified by the quantification method or thesemi-quantification method described above is more preferably 0.08 mol %or less, still more preferably 0.05 mol % or less, particularlypreferably substantially 0.0 mol %.

A conventionally known synthesis method includes causing apolymerization-active phosgene gas to react with a mixture of abisphenol monomer and a polyorganosiloxane monomer or with apolyorganosiloxane. Accordingly, even when the amount of the blockrepresented by the general formula (III) is reduced by improving amethod of adding the phosgene gas and the time period for which the gasis brought into contact with the mixture or the polyorganosiloxane, itis impossible to set the amount of the block represented by the generalformula (III) to substantially 0.0 mol % because contact between aplurality of polyorganosiloxane monomer molecules and thepolymerization-active phosgene gas is inevitable.

Meanwhile, the PC-POS copolymer (A) in the polycarbonate-based resincomposition of the present invention is preferably synthesized asdescribed below. A bisphenol monomer and a phosgene gas are caused toreact with each other in advance to synthesize a bisphenol monomer orbisphenol polycarbonate oligomer both the terminals of which are each achloroformate structure. The block represented by the general formula(III) cannot be substantially produced because a polymerization-inactivepolyorganosiloxane monomer is, or the polymerization-inactivepolyorganosiloxane monomer and a polymerization-inactive bisphenolmonomer are, caused to react with the bisphenol monomer havingpolymerization-active chloroformate groups at both of its terminals orthe bisphenol polycarbonate oligomer having polymerization-activechloroformate groups at both of its terminals.

[Compound (B)]

The polycarbonate-based resin composition of the present inventioncomprises, as a component (B), at least one kind of compound selectedfrom the group consisting of an antioxidant, a dye, a release agent, alight-diffusing agent, a flame retardant, a UV absorber, asilicone-based compound, an epoxy compound, and a polyether compound. Inone embodiment of the present invention, the polycarbonate-based resincomposition comprises, as the component (B), 0.001 part by mass to 0.5part by mass of the antioxidant, 0.00001 part by mass to 0.05 part bymass of the dye, 0.001 part by mass to 0.5 part by mass of the releaseagent, 0.1 part by mass to 5 parts by mass of the light-diffusing agent,0.001 part by mass to 20 parts by mass of the flame retardant, 0.01 partby mass to 1 part by mass of the UV absorber, 0.01 part by mass to 0.25part by mass of the silicone-based compound, 0 parts by mass to 0.2 partby mass of the epoxy compound, and/or 0.2 part by mass to 1 part by massof the polyether compound with respect to 100 parts by mass of thePC-POS copolymer (A). The compounds are described in detail below.

<Antioxidant>

The compound (B) in the polycarbonate resin composition of the presentinvention preferably contains an antioxidant. The incorporation of theantioxidant can prevent the oxidative deterioration of thepolycarbonate-based resin composition at the time of its melting, andhence can prevent its coloring or the like due to the oxidativedeterioration. For example, a phosphorus-based antioxidant and/or aphenol-based antioxidant is suitably used as the antioxidant.

1. Phosphorus-Based Antioxidant

The phosphorus-based antioxidant is preferably a phosphite-basedantioxidant or a phosphine-based antioxidant from the viewpoint ofobtaining a resin composition capable of suppressing the occurrence of,for example, its discoloration even when retained at high temperatures.

Examples of the phosphite-based antioxidant include trisnonylphenylphosphite, triphenyl phosphite, tridecyl phosphite, trioctadecylphosphite, tris(2,4-di-tert-butylphenyl)phosphite (e.g., product name“Irgafos 168” manufactured by BASF),bis-(2,4-di-tert-butylphenyl)pentaerythritol-diphosphite (e.g., productname “Irgafos 126” manufactured by BASF and product name “ADK STABPEP-24G” manufactured by ADEKA Corporation),bis-(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite (e.g., productname “Irgafos 38” manufactured by BASF),bis-(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol-diphosphite (e.g.,product name “ADK STAB PEP-36” manufactured by ADEKA Corporation),distearyl-pentaerythritol-diphosphite (e.g., product name “ADK STABPEP-8” manufactured by ADEKA Corporation and product name “JPP-2000”manufactured by Johoku Chemical Co., Ltd.),[bis(2,4-di-tert-butyl-5-methylphenoxy)phosphino]biphenyl (e.g., productname “GSY-P101” manufactured by Osaki Industry Co., Ltd.),2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetra-tert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol(e.g., product name “Sumilizer GP” manufactured by Sumitomo ChemicalCompany, Limited), andtris[2-[[2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-6-yl]oxy]ethyl]amine(e.g., product name “Irgafos 12” manufactured by BASF).

Further, examples include compounds represented by the followingformulae (12) to (15).

Among those phosphite-based antioxidants, from the viewpoint of thehydrolysis resistance, tris-2,4-di-tert-butylphenyl phosphite,bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite,bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, andbis(2,4-dicumylphenyl)pentaerythritol diphosphite (Doverphos S-9228PC)are more preferred.

The phosphine-based antioxidant is, for example, triphenylphosphine(“JC263” manufactured by Johoku Chemical Co., Ltd.).

When the phosphorus-based antioxidant is used as the antioxidant, itscontent is preferably from 0.002 part by mass to 0.2 part by mass, morepreferably from 0.003 part by mass to 0.1 part by mass, still morepreferably from 0.003 part by mass to 0.1 part by mass with respect to100 parts by mass of the PC-POS copolymer (A). When the content fallswithin the ranges, the discoloration of the resin composition, theoccurrence of silver, and the like at the time of the retention of thecomposition at high temperatures can be sufficiently suppressed.

2. Phenol-Based Antioxidant

Examples of the phenol-based antioxidant include hindered phenols, suchas n-octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate,2,6-di-tert-butyl-4-methylphenol,2,2′-methylenebis(4-methyl-6-tert-butylphenol), andpentaerythrityl-tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate].

Examples of the phenol-based antioxidant may include commerciallyavailable products, such as Irganox 1010 (manufactured by BASF Japan,trademark), Irganox 1076 (manufactured by BASF Japan, trademark),Irganox 1330 (manufactured by BASF Japan, trademark), Irganox 3114(manufactured by BASF Japan, trademark), Irganox 3125 (manufactured byBASF Japan, trademark), BHT (manufactured by Takeda PharmaceuticalCompany, trademark), Cyanox 1790 (manufactured by American CyanamidCompany, trademark), and Sumilizer GA-80 (manufactured by SumitomoChemical Co., Ltd., trademark).

The content of the antioxidant except those described in the section “1.Phosphorus-based Antioxidant” is from about 0.001 part by mass or moreto about 0.5 part by mass or less, preferably from 0.01 part by mass ormore to 0.3 part by mass or less, more preferably from 0.02 part by massor more to 0.3 part by mass or less with respect to 100 parts by mass ofthe PC-POS copolymer (A). When the content of the antioxidant is 0.001part by mass or more, a sufficient antioxidant effect is obtained, andwhen the content is 0.5 part by mass or less, the contamination of amold to be used at the time of the molding of the polycarbonate-basedresin composition can be sufficiently suppressed.

<Dye>

The compound (B) in the polycarbonate-based resin composition of thepresent invention may contain a dye (pigment). The dye is notparticularly limited, and only needs to be a compound classified as adye in the Colour Index (published by the Society of Dyers andColourists). Examples thereof include red, blue, green, yellow, orange,purple, brown, and black water-soluble acid dyes, metal-containing dyes,basic dyes, cationic dyes, direct dyes, and reactive dyes, andwater-insoluble dispersion dyes, sulfide dyes, and vat dyestuffs. Thedye may be an organic dye or an inorganic dye. More specific examplesthereof include a metal phthalocyanine pigment, a cyanine dye, ananthracene pigment, a bisazo pigment, a pyrene pigment, a polycyclicquinone pigment, a quinacridone pigment, an indigo pigment, a perylenepigment, a pyrylium dye, a squarium pigment, an anthanthrone pigment, abenzimidazole pigment, an azo pigment, a thioindigo pigment, a quinolinepigment, a lake pigment, an oxazine pigment, a dioxazine pigment, atriphenylmethane pigment, an azulenium dye, a triarylmethane dye, axanthine dye, a thiazine dye, a thiapyrylium dye, polyvinylcarbazole, abisbenzimidazole pigment, and an anthraquinone-based dye.

The content of the dye in the polycarbonate-based resin composition ofthe present invention is from about 0.00001 part by mass or more toabout 0.05 part by mass or less, preferably from 0.0001 part by mass ormore to 0.005 part by mass or less, more preferably from 0.0001 part bymass or more to 0.0005 part by mass or less with respect to 100 parts bymass of the PC-POS copolymer (A).

<Release Agent>

The compound (B) in the polycarbonate-based resin composition of thepresent invention may contain a release agent. As the release agent, forexample, a fatty acid ester, a polyolefin-based wax, a fluorine oil, ora paraffin wax may be used. Among them, a fatty acid ester is preferred,and a partial ester, such as stearic acid monoglyceride, stearic aciddiglyceride, stearic acid monosorbitate, behenic acid monoglyceride,pentaerythritol monostearate, pentaerythritol distearate,pentaerythritol tetrastearate, propylene glycol monostearate, orsorbitan monostearate, is more preferred.

The content of the release agent in the polycarbonate-based resincomposition of the present invention is from about 0.001 part by mass ormore to about 0.5 part by mass or less, preferably from 0.01 part bymass or more to 0.3 part by mass or less, more preferably from 0.03 partby mass or more to 0.3 part by mass or less with respect to 100 parts bymass of the PC-POS copolymer (A).

<Light-Diffusing Agent>

The compound (B) in the polycarbonate-based resin composition of thepresent invention may contain a light-diffusing agent. Thelight-diffusing agent is blended for imparting a light-diffusing effectto the composition, and is not particularly limited, and a knownlight-diffusing agent may be used. Examples thereof include acrosslinked acrylic resin, a crosslinked polystyrene resin, a siliconeresin, a fluorine-based resin, silica, quartz, titanium oxide, and zincoxide.

Among them, a Si-based light-diffusing agent is preferred because theagent can impart a flame retardancy expression-aiding effect and alight-diffusing effect to the polycarbonate-based resin composition. TheSi-based light-diffusing agent is not particularly limited as long asthe agent contains silicon (Si), and a known agent may be used. Examplesthereof include a silicone-based elastomer and a silicone resin. Organicfine particles each formed of the silicone resin among them arepreferred because the fine particles have satisfactory retention heatstability at the time of, for example, the molding of the composition,and have a flame retardancy-improving effect. The particle diameter ofeach of the fine particles is preferably from 0.5 μm to 10 μm, morepreferably from 1 μm to 5 μm.

The content of the light-diffusing agent in the polycarbonate-basedresin composition of the present invention is preferably from 0.1 partby mass to 5 parts by mass, more preferably from 0.1 part by mass to 4parts by mass, still more preferably from 0.1 part by mass to 3 parts bymass with respect to 100 parts by mass of the PC-POS copolymer (A),though the optimum value of the content varies depending on thethickness of a molded article of the composition. When the content ofthe light-diffusing agent falls within the ranges, sufficient diffusionperformance is obtained and the strength of the molded article can besufficiently kept. In the case where the light-diffusing agent is added,the total light transmittance of a test piece formed of the compositionentirely reduces in accordance with its addition amount. Even in thiscase, however, according to the present invention, a difference intransmittance caused by the thickness of the test piece is small, andhence an excellent transmittance can be maintained.

Specifically, the following diffusing agents may each be used.

Bead-shaped crosslinked silicone (manufactured by Momentive PerformanceMaterials Japan LLC: TSR9002 (product name), average particle diameter:2 μm)

Bead-shaped crosslinked acrylic particles (manufactured by Sekisui KaseiCo., Ltd.: MBX-5 (product name), average particle diameter: 5 μm)

Bead-shaped crosslinked acrylic particles (manufactured by Toagosei Co.,Ltd.: SDP-S225 (product name), average particle diameter: 2 μm)

<Flame Retardant>

The compound (B) in the polycarbonate-based resin composition of thepresent invention may contain a flame retardant. Examples of the flameretardant include an organic alkaline metal salt, an organic alkalineearth metal salt, a phosphorus-based flame retardant, a silicone-basedflame retardant, and expanded graphite, and the flame retardants may beused alone or in combination thereof. The flame retardant is preferablyany one kind of the organic alkaline metal salt, the organic alkalineearth metal salt (hereinafter sometimes collectively referred to as“organic alkaline (earth) metal salts”), and the phosphorus-based flameretardant. Among them, the organic alkaline metal salt or thephosphorus-based flame retardant is more preferred.

Although examples of the organic alkaline (earth) metal salts includevarious salts, an alkaline metal salt and an organic alkaline earthmetal salt of an organic acid or organic acid ester having at least onecarbon atom may each be used.

Examples of the organic acid or organic acid ester include an organicsulfonic acid and an organic carboxylic acid. Examples of the alkalinemetal may include lithium, sodium, potassium, and cesium. Examples ofthe alkaline earth metal may include magnesium, calcium, strontium, andbarium. Among the alkaline metals, sodium and potassium are preferred,and potassium is particularly preferred from the viewpoints of the flameretardancy and the thermal stability. In addition, the organic acid saltthereof may be substituted with a halogen, such as fluorine, chlorine,or bromine. The alkaline (earth) metal salts may be used alone or incombination thereof.

In the case of, for example, an organic sulfonic acid, an alkaline(earth) metal salt of a perfluoroalkane sulfonic acid represented by thefollowing formula (11) among the above-mentioned various organicalkaline (earth) metal salts is preferably used:

(C_(e)F_(2e+1)SO₃)_(f)M  (11)

wherein “e” represents an integer of from 1 to 10, M represents analkaline metal, such as lithium, sodium, potassium, or cesium, or analkaline earth metal, such as magnesium, calcium, strontium, or barium,and “f” represents the valence of M.

Compounds described in, for example, JP 47-40445 B correspond to thosecompounds.

Examples of the perfluoroalkane sulfonic acid represented by the formula(11) may include perfluoromethane sulfonic acid, perfluoroethanesulfonic acid, perfluoropropane sulfonic acid, perfluorobutane sulfonicacid, perfluoromethylbutane sulfonic acid, perfluorohexane sulfonicacid, perfluoroheptane sulfonic acid, and perfluorooctane sulfonic acid.Potassium salts thereof are particularly preferably used. Examples ofthe organic alkaline (earth) metal salts may also include alkaline metalsalts of organic sulfonic acids, such as p-toluene sulfonic acid,2,5-dichlorobenzene sulfonic acid, 2,4,5-trichlorobenzene sulfonic acid,diphenylsulfone-3-sulfonic acid, diphenylsulfone-3,3′-disulfonic acid,and naphthalene trisulfonic acid.

Examples of the organic carboxylic acid may include perfluoroformicacid, perfluoromethane carboxylic acid, perfluoroethane carboxylic acid,perfluoropropane carboxylic acid, perfluorobutane carboxylic acid,perfluoromethylbutane carboxylic acid, perfluorohexane carboxylic acid,perfluoroheptane carboxylic acid, and perfluorooctane carboxylic acid,and an alkaline metal salt of any of those organic carboxylic acids isused.

When the flame retardant is an organic alkaline (earth) metal salt, itsblending amount is preferably 0.001 part by mass or more, morepreferably 0.01 part by mass or more, still more preferably 0.02 part bymass or more with respect to 100 parts by mass of the PC-POS copolymer(A), and is preferably 1 part by mass or less, more preferably 0.1 partby mass or less, still more preferably 0.08 part by mass or less withrespect thereto. When the blending amount falls within the ranges, moreexcellent flame retardancy is obtained.

Examples of the phosphorus-based flame retardant include red phosphorusand a phosphoric acid ester-based flame retardant.

The phosphoric acid ester-based flame retardant is particularlypreferably a flame retardant free of a halogen, and examples thereofinclude flame retardants each formed of a monomer, an oligomer, or apolymer of a phosphoric acid ester, or a mixture thereof. Specificexamples thereof include triphenyl phosphate, tricresyl phosphate,cresyl diphenyl phosphate, trixylenyl phosphate, tris(isopropylphenyl)phosphate, trinaphthyl phosphate, biphenol bisphosphate, bisphenol Abisphosphate, hydroquinonebisphosphate, resorcin bisphosphate,resorcinol-diphenyl phosphate, and trioxybenzene triphosphate, andsubstituted products and condensates thereof. The phosphorus-based flameretardants may be used alone or in combination thereof.

When the flame retardant is a phosphorus-based flame retardant, itsblending amount is preferably 0.1 part by mass or more, more preferably1 part by mass or more with respect to 100 parts by mass of the PC-POScopolymer (A), and is preferably 20 parts by mass or less, morepreferably 15 parts by mass or less, still more preferably 10 parts bymass or less with respect thereto. When the blending amount is 0.1 partby mass or more, more excellent flame retardancy is obtained, and whenthe blending amount is 20 parts by mass or less, reductions in, forexample, chemical resistance, heat resistance, tensile elongation, andimpact resistance of the polycarbonate-based resin composition can befurther suppressed.

<UV Absorber>

The compound (B) in the polycarbonate-based resin composition of thepresent invention may contain a UV absorber.

Examples of the UV absorber include a benzotriazole-based compound, abenzoxazine-based compound, a salicylate-based compound, a malonic acidester-based compound, an oxalylanilide-based compound, a triazine-basedcompound, a benzophenone-based compound, and a cyanoacrylate-basedcompound. Those compounds may be used alone or in combination thereof.

Specific examples of the benzotriazole-based compound may include2-(2′-hydroxy-5′-tert-octylphenyl)benzotriazole,2-(2′-hydroxy-3′,5′-di-tert-amylphenyl)benzotriazole,2-(2′-hydroxy-5′-tert-butylphenyl)benzotriazole,2-(2′-hydroxy-3′,5′-di-tert-butylphenyl)benzotriazole,2-[2′-hydroxy-3′,5′-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole,2,2′-methylene-bis[4-methyl-6-(benzotriazol-2-yl)phenol], and2,2′-methylenebis(6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol).

Specific examples of the triazine-based compound may include2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol and2-(4,6-bis-2,4-dimethylphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol.

Specific examples of the benzophenone-based compound may include2-hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-methoxy-benzophenone, and2-hydroxy-4-ethoxy-benzophenone.

Specific examples of the cyanoacrylate-based compound may include2-ethyl-2-cyano-3,3-diphenyl acrylate, 2-ethylhexyl-2-cyano-3,3-diphenylacrylate, and1,3-bis-[2′-cyano-3,3′-diphenylacryloyloxy]-2,2-bis-[(2-cyano-3′,3′-diphenylacryloyl)oxy]methylpropane.

An example of the benzoxazine-based compound may be at least one kind ofcompound represented by the following general formula (21):

wherein R¹¹¹ to R¹²² are each independently selected from the groupconsisting of a hydrogen atom, a hydroxyl group, a C1 to C8 alkyl group,a C1 to C8 alkoxy group, an aryl group, a carboxyl group, a sulfonicacid group, a mercaptan group, a thiol group, a cyano group, athiocyanic acid group, an amino group, a C1 to C8 alkyl ester group, anitro group, and a halogen atom.

The compound represented by the general formula (21) is a compound of astructure having two benzoxazinone skeletons at the para-positions of abenzene ring, and carbon at the 2-position of each of the benzoxazinoneskeletons is bonded to carbon at each of the para-positions of thebenzene ring. Each of the three benzene rings of the structure may have1 to 4 substituents, or may be free of any substituent. The positions ofthe substituents are not limited. The kinds of the substituents may beselected independently of each other, and may be identical to ordifferent from each other.

R¹¹¹ to R¹²² in the general formula (21) are each independently selectedpreferably from the group consisting of a hydrogen atom, a hydroxylgroup, a C1 to C8 alkyl group, a C1 to C8 alkoxy group, an aryl group, acarboxyl group, and a sulfonic acid group, more preferably from thegroup consisting of a hydrogen atom, a hydroxyl group, a carboxyl group,and a sulfonic acid group, still more preferably from the groupconsisting of a hydrogen atom and a sulfonic acid group. A compoundrepresented by the general formula (I) in which all of R¹¹¹ to R¹²²represent hydrogen atoms(2,2′-(1,4-phenylene)bis[4H-3,1-benzoxazin-4-one]) may be preferablyused.

A commercially available product may be used as the compound representedby the general formula (21). Examples of the commercially availableproduct include “Cyasorb (trademark) UV-3638F” (product name)manufactured by Cytec Industries Inc., “ELECUT ZA-101” (product name)manufactured by Takemoto Oil & Fat Co., Ltd., and “KEMISORB 500”(product name) manufactured by Chemipro Kasei Kaisha, Ltd.

Among them, at least one kind selected from the group consisting of amalonic acid ester-based compound, a benzotriazole-based compound, atriazine-based compound, and a benzoxazine-based compound is preferred.

Examples of the UV absorber may include commercially available products,such as SEESORB 709 (Shipro Kasei Kaisha, Ltd., trademark), KEMISORB 79(Chemipro Kasei Kaisha, Ltd., trademark), KEMISORB 279 (Chemipro KaseiKaisha, Ltd., trademark), Hostavin B-CAP (manufactured by Clariant AG,trademark), Tinuvin 234 (manufactured by BASF Japan Ltd., trademark),Tinuvin 1577 (manufactured by BASF Japan Ltd., trademark), and CyasorbUV-3638F (manufactured by Cytec Industries Inc.).

The content of the UV absorber is from about 0.01 part by mass or moreto about 1 part by mass or less, preferably from 0.05 part by mass ormore to 0.7 part by mass or less, more preferably from 0.1 part by massor more to 0.5 part by mass or less with respect to 100 parts by mass ofthe PC-POS copolymer. When the content of the UV absorber is 0.01 partby mass or more, sufficient light fastness is obtained, and when thecontent is 1 part by mass or less, the contamination of a mold to beused at the time of the molding of the polycarbonate-based resincomposition can be sufficiently suppressed.

<Silicone-Based Compound>

The compound (B) in the polycarbonate-based resin composition of thepresent invention may contain a silicone-based compound.

The silicone-based compound has the following effects: at the time ofthe pelletization of the polycarbonate-based resin composition of thepresent invention, the compound acts like a lubricant to suppress itsyellowing; and at the time of the molding thereof, the compound preventsan appearance failure, such as silver. As the silicone-based compound,there may be used a silicone-based compound having a hydrocarbon grouphaving 1 to 12 carbon atoms, the group being bonded to a silicon atom,as represented by a compound such as a polydimethylsiloxane, apolymethylethylsiloxane, or a polymethylphenylsiloxane. In particular, asilicone-based compound having a functional group is preferably used.The silicone-based compound having a functional group is a polymer orcopolymer comprising a structural unit represented by(R¹)_(a)(R²)_(b)SiO_((4-a-b)/2) wherein R¹ represents a functionalgroup, R² represents a hydrocarbon group having 1 to 12 carbon atoms,and “a” and “b” represent integers satisfying 0<a≤3, 0≤b<3, and 0<a+b≤3.Examples of the functional group represented by R¹ include an alkoxygroup, an aryloxy group, a polyoxyalkylene group, a hydrogen group, ahydroxy group, a carboxyl group, a silanol group, an amino group, amercapto group, an epoxy group, and a vinyl group. Among them, an alkoxygroup, a hydrogen group, a hydroxy group, an epoxy group, and a vinylgroup are preferred, and a methoxy group and a vinyl group are morepreferred. Examples of the hydrocarbon group represented by R² include amethyl group, an ethyl group, and a phenyl group.

Among the silicone-based compounds having functional groups, afunctional group-containing silicone-based compound comprising astructural unit containing a phenyl group as the hydrocarbon grouprepresented by R² in the above-mentioned formula has particularly highusefulness. A compound containing one kind of functional group as thefunctional group represented by R¹ in the formula may be used, acompound containing a plurality of different kinds of functional groupsmay be used, or a mixture of the compounds may be used. A compoundhaving a value of the ratio of the amount of the functional group (R¹)to the amount of the hydrocarbon group (R²) in the formula of from 0.1to 3, preferably from 0.3 to 2 is suitably used. The silicone-basedcompound having a functional group may be liquid or powdery. In the caseof a liquid compound, its viscosity at room temperature is preferablyfrom about 10 cSt to about 500,000 cSt. When the polycarbonate-basedresin composition is used in an optical application, a difference inrefractive index between the silicone-based compound and thepolycarbonate resin of the composition is preferably reduced, and therefractive index of the silicone-based compound is preferably from 1.45to 1.65, more preferably from 1.48 to 1.60.

In the polycarbonate-based resin composition of the present invention,the sodium content of the silicone-based compound is preferably 15 ppmby mass or less. When the sodium content in the silicone-based compoundis 15 ppm by mass or less, at the time of the production of a moldedarticle through use of the polycarbonate-based resin composition, anincrease in yellowness of the molded article can be suppressed. Thesodium content in the silicone-based compound is desirably 10 ppm bymass or less. A commercial compound may be used as the silicone-basedcompound. However, the sodium contents of the commercial compounds maydiffer from each other, and even those of products that are manufacturedby the same manufacturer and have the same grade may differ from eachother. Accordingly, when the silicone-based compound is used, thefollowing is preferably performed: the sodium contents of such compoundsare examined in advance, and a silicone-based compound having a lowsodium content is used; or such compound is used after having beenreduced in sodium content. The silicone-based compound may be coloredpale yellow, and hence a silicone-based compound colored to a smallextent is desirably used. As a method of reducing the amount of a metalcomponent, such as sodium, there has been known a method includingsubjecting the component to adsorption treatment with, for example,aluminum hydroxide, synthetic hydrotalcite, magnesium silicate, aluminumsilicate, or activated carbon.

The polycarbonate-based resin composition of the present invention mayinclude the silicone-based compound at a content of from 0.01 part bymass to 0.25 part by mass with respect to 100 parts by mass of thePC-POS copolymer (A). When the content of the silicone-based compoundfalls within the range, heat stability at the time of the molding of thepolycarbonate-based resin composition is excellent, and the appearanceof the surface of the resultant molded article can be kept satisfactory.The content of the silicone-based compound in the polycarbonate-basedresin composition is preferably from 0.03 part by mass to 0.2 part bymass, more preferably from 0.05 part by mass to 0.15 part by mass withrespect to 100 parts by mass of the PC-POS copolymer (A). The content ofthe silicone-based compound in the polycarbonate-based resin compositionmay be measured by gas chromatography, and the content does not largelychange from the blending amount thereof before the melt-kneading of thecomposition.

<Epoxy Compound>

Basically, the polycarbonate-based resin composition of the presentinvention preferably contains an epoxy compound when the phosphite-basedantioxidant is used as the compound (B).

The phosphite-based antioxidant is more liable to hydrolyze under amoist heat environment than the polycarbonate resin is. Further,decomposition products such as phosphoric acids and phenols produced bythe hydrolysis may remarkably promote the hydrolysis of thepolycarbonate resin.

The inventors of the present invention have found that the epoxycompound has the following action: the compound suppresses thehydrolysis of the phosphite-based antioxidant or detoxifies adecomposition product produced by the hydrolysis of the phosphite-basedantioxidant. The reduction ratio of the viscosity-average molecularweight can be adjusted to the predetermined value or less as long as theepoxy compound is used in combination even when 0.02 part by mass ormore of the phosphite-based antioxidant is added to the PC-POS copolymer(A).

The epoxy compound is, for example, a compound a part of the structureof which is epoxidized.

Among the epoxy compounds, an alicyclic epoxy compound, or an epoxidizednatural oil or epoxidized synthetic oil having an oxirane oxygenconcentration of 4% or more is preferred from the above-mentionedviewpoint.

When a molded body formed of the resin composition is used in anapplication such as a container for food, the epoxidized natural oil orepoxidized synthetic oil having an oxirane oxygen concentration of 4% ormore is more preferred from the viewpoint of obtaining a molded bodythat can safely preserve food.

Examples of the alicyclic epoxy compound include3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate (e.g., aproduct available under the product name “CELLOXIDE 2021P” from DaicelChemical Industries, Ltd.), a 1,2-epoxy-4-(2-oxiranyl)cyclohexane adductof 2,2-bis(hydroxymethyl)-1-butanol (e.g., a product available under theproduct name “EHPE3150” from Daicel Chemical Industries, Ltd.), and amixture of these two kinds (available under the product name“EHPE3150CE” from Daicel Chemical Industries, Ltd.).

Examples of the epoxidized natural oil having an oxirane oxygenconcentration of 4% or more include SANSO CIZER E-2000H (product name,manufactured by New Japan Chemical Co., Ltd., epoxidized soybean oil,oxirane oxygen concentration: 6.7% or more) and SANSO CIZER E-9000H(product name, manufactured by New Japan Chemical Co., Ltd., epoxidizedlinseed oil, oxirane oxygen concentration: 8.5% or more).

Examples of the epoxidized synthetic oil having an oxirane oxygenconcentration of 4% or more include SANSO CIZER E-PO (product name,manufactured by New Japan Chemical Co., Ltd., diepoxystearylepoxyhexahydrophthalate, oxirane oxygen concentration: 5.5% or more) andSANSO CIZER E-4030 (product name, manufactured by New Japan ChemicalCo., Ltd., epoxidized fatty acid butyl, oxirane oxygen concentration:4.5% or more).

The oxirane oxygen concentration of the epoxidized natural oil or theepoxidized synthetic oil is 4% or more, preferably 5% or more, morepreferably 6% or more, still more preferably 7% or more. When theoxirane oxygen concentration is less than 4%, a suppressing effect onthe hydrolysis of the phosphite-based antioxidant or a detoxifyingeffect on a decomposition product produced by the hydrolysis is low, andas a result, the hydrolysis of the polycarbonate cannot be suppressedand it becomes difficult to adjust the reduction ratio of the molecularweight to the predetermined value or less.

The oxirane oxygen concentration means a value measured with a solutionof hydrogen bromide in acetic acid on the basis of the provisions ofASTM-1652.

The content of the epoxy compound is from 0 parts by mass to 0.2 part bymass with respect to 100 parts by mass of the PC-POS copolymer (A)component. When the content falls within the range, the fluidity of thepolycarbonate-based resin composition is kept satisfactory, and hence noinconvenience occurs at the time of its molding processing.

<Polyether Compound>

The polycarbonate-based resin composition of the present invention mayinclude, as the compound (B), a polyether compound having apolyoxyalkylene structure. The polyether compound can improve an initialcolor tone at the time of the molding of the polycarbonate-based resincomposition. The polyether compound having a polyoxyalkylene structurepreferably has a polyoxyalkylene structure represented by (R^(C1)O)_(m)and a polyoxyalkylene structure represented by (R^(C2)O)_(n). Herein,R^(C1) and R^(C2) each independently represent an alkylene group having1 or more carbon atoms, and m+n represents from 5 or more to less than300, preferably from 10 to 200, more preferably from 20 to 100.

Examples of the alkylene group represented by any one of R^(C1) andR^(C2) include a methylene group, an ethylene group, a trimethylenegroup, a propylene group, a tetramethylene group, and a hexamethylenegroup. Among them, an alkylene group having 1 to 5 carbon atoms ispreferred.

In the “m” R^(C1)O groups, the plurality of R^(C1) may representalkylene groups identical to each other, or may represent alkylenegroups different from each other in number of carbon atoms. That is, thepolyoxyalkylene group represented by (R^(C1)O)_(m) is not limited to agroup having a single oxyalkylene unit as a repeating unit, such as apolyoxyethylene group or a polyoxypropylene group, and may be a grouphaving, as repeating units, a plurality of oxyalkylene units differentfrom each other in number of carbon atoms, such as an oxyethylene unitand an oxypropylene unit.

R^(C2) is similar to R^(C1), and in the “n” R^(C2)O groups, theplurality of R^(C2) may represent alkylene groups identical to eachother, or may represent alkylene groups different from each other innumber of carbon atoms.

In particular, from the viewpoint of improving the initial color tone,it is preferred that R^(C1) and R^(C2) each represent an alkylene groupselected from an ethylene group, a propylene group, and a tetramethylenegroup among the above-mentioned alkylene groups represented by R^(C1)and R^(C2), and at least one of R^(C1) or R^(C2) represent one of anethylene group and a propylene group.

In addition, the polyether compound is preferably at least one kindselected from the group consisting of a compound represented by thefollowing general formula (IX), an alkylene oxide adduct of a polyhydricalcohol and an ester thereof, and a cyclic polyether compound:

R^(C3)O—(R^(C1)O)_(m)-A-(R^(C2)O)_(n)—R^(C4)  (IX)

wherein R^(C1) and R^(C2) each independently represent an alkylene grouphaving 1 or more carbon atoms, m+n represents from 5 or more to lessthan 300, R^(C3) and R^(C4) each independently represent a hydrogenatom, a hydrocarbon group having 1 to carbon atoms, an alkanoyl grouphaving 1 to 30 carbon atoms, an alkenoyl group having 2 to 30 carbonatoms, or a glycidyl group, and A represents a single bond or a divalentorganic group.

The alkylene group represented by any one of R^(C1) and R^(C2) is asdescribed above. In addition, the polyoxyalkylene structure representedby (R^(C1)O)_(m) and the polyoxyalkylene structure represented by(R^(C2)O)_(n) are also as described above.

The hydrocarbon group having 1 to 30 carbon atoms that is represented byany one of R^(C3) and R^(C4) is, for example, an alkyl group having 1 to30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, an arylgroup having 6 to carbon atoms, or an aralkyl group having 7 to 30carbon atoms.

The alkyl group and the alkenyl group may be linear, branched, orcyclic, and examples thereof include a methyl group, an ethyl group, an-propyl group, an isopropyl group, various butyl groups, various pentylgroups, various hexyl groups, various octyl groups, a cyclopentyl group,a cyclohexyl group, an allyl group, a propenyl group, various butenylgroups, various hexenyl groups, various octenyl groups, a cyclopentenylgroup, and a cyclohexenyl group. Examples of the aryl group include aphenyl group, a tolyl group, and a xylyl group. Examples of the aralkylgroup include a benzyl group, a phenethyl group, and a methylbenzylgroup.

The alkanoyl group having 1 to 30 carbon atoms represented by any one ofR^(C3) and R^(C4) may be linear or branched, and examples thereofinclude a methanoyl group, an ethanoyl group, a n-propanoyl group, anisopropanoyl group, a n-butanoyl group, a t-butanoyl group, a n-hexanoylgroup, a n-octanoyl group, a n-decanoyl group, a n-dodecanoyl group, anda benzoyl group. Among them, an alkanoyl group having 1 to 20 carbonatoms is preferred from the viewpoints of the compatibility, heatstability, and ease of production of the polycarbonate-based resincomposition.

The alkenoyl group having 2 to 30 carbon atoms represented by any one ofR^(C3) and R^(C4) may be linear or branched, and examples thereofinclude an ethenoyl group, a n-propenoyl group, an isopropenoyl group, an-butenoyl group, a t-butenoyl group, a n-hexenoyl group, a n-octenoylgroup, a n-decenoyl group, and a n-dodecenoyl group. Among them, analkenoyl group having 2 to 10 carbon atoms is preferred, and an alkenoylgroup having 2 to 6 carbon atoms is more preferred from the viewpoint ofreducing the molecular weight of the composition, from the viewpoints ofthe compatibility and solubility thereof, and from the viewpoint of theease of production thereof.

An example of the divalent organic group represented by A is a grouprepresented by the following formula (a).

Specific examples of the polyether compound represented by the generalformula (IX) include polyethylene glycol, polypropylene glycol,polytetramethylene glycol, polyoxytetramethylene polyoxyethylene glycol,polyoxyethylene polyoxypropylene glycol, polyoxyethylene monomethylether, polyoxyethylene dimethyl ether, polyoxyethylene-bisphenol Aether, polyoxypropylene-bisphenol A ether,polyoxyethylene-polyoxypropylene-bisphenol A ether, polyethyleneglycol-allyl ether, polyethylene glycol-diallyl ether, polypropyleneglycol-allyl ether, polypropylene glycol-diallyl ether, polyethyleneglycol-polypropylene glycol-allyl ether, polyethylene glycoldimethacrylate, polypropylene glycol dimethacrylate, and polypropyleneglycol distearate. Those compounds are available as commerciallyavailable products, and for example, “UNIOX (trademark)”, “UNIOL(trademark)”, “UNILUBE (trademark)”, “UNISAFE (trademark)”, “POLYCERIN(trademark)”, and “EPIOL (trademark)” manufactured by NOF Corporationmay be used.

Examples of the polyhydric alcohol in the alkylene oxide adduct of thepolyhydric alcohol and the ester thereof include glycerin, diglycerylether, and sorbitol.

Specific examples of the cyclic polyether compound include 18-crown-6and dibenzo-18-crown-6.

As the polyether compound, at least one kind selected from polyethyleneglycol, polypropylene glycol, and polyoxyethyleneglycol-polyoxypropylene glycol is preferably used.

The number-average molecular weight of the polyether compound, which isnot particularly limited, is preferably from 200 to 10,000, morepreferably from 500 to 8,000, still more preferably from 1,000 to 5,000.

The content of the polyether compound in the polycarbonate-based resincomposition of the present invention is preferably from 0.2 part by massto 1 part by mass, more preferably from 0.2 part by mass to 0.9 part bymass, still more preferably from 0.3 part by mass to 0.8 part by masswith respect to 100 parts by mass of the PC-POS copolymer (A). When thecontent of the polyether compound is 0.2 part by mass or more, theinitial YI value of a molded body of the composition can be keptsatisfactory. When the content of the polyether compound is 1 part bymass or less, the YI value of a molded article of the composition can bekept satisfactory at the time of its holding under high temperatures orat the time of its holding at high humidities. Accordingly, the moldedarticle is excellent in color tone, and hence does not adversely affectthe transparency of an optical molded article, such as a light-guidingplate.

The melt-kneading of the PC-POS copolymer can provide a raw materialpellet. The compound (B) may be added at the time of the melt-kneading.Other additives may include a reinforcing material, a filler, anelastomer for improving impact resistance, an antistatic agent, andother resins except a polycarbonate. With regard to the addition amountof such additive, the additive may be appropriately selected and addedat an appropriate ratio.

In the present invention, the polycarbonate-based resin composition ispreferably free of a polycarbonate-based resin except the PC-POScopolymer (A) as a polycarbonate-based resin component. When only thepolycarbonate-polyorganosiloxane copolymer (A) is used as apolycarbonate-based resin component, the composition has highflexibility and can maintain high transparency.

According to one aspect of the present invention, the content of thepolyorganosiloxane block (A-2) in the polycarbonate-based resincomposition is preferably from more than 40 mass % to 70 mass % or less.The content of the polyorganosiloxane block (A-2) in the resincomposition is more preferably 41 mass % or more, still more preferably45 mass % or more, for example, more than 50 mass %, and is morepreferably 65 mass % or less, still more preferably 62 mass % or less.

The melt-kneading may be performed by a method involving premixing witha typically used apparatus, such as a ribbon blender or a drum tumbler,and using, for example, a Henschel mixer, a Banbury mixer, asingle-screw extruder, a twin-screw extruder, a multi-screw extruder, ora Ko-kneader. In normal cases, a heating temperature at the time of thekneading is appropriately selected from the range of from 240° C. ormore to 320° C. or less. An extruder, in particular a vented extruder ispreferably used in the melt-kneading.

<Molded Body>

Various molded bodies may each be produced by an injection moldingmethod, an injection compression molding method, an extrusion moldingmethod, a blow molding method, a press molding method, a vacuum moldingmethod, an expansion molding method, or the like using as a raw materialthe melt-kneaded polycarbonate-based resin composition or a pelletobtained through the melt-kneading.

The molded body of the polycarbonate-based resin composition of thepresent invention has a feature of having both of excellent flexibilityand transparency derived from the PC-POS copolymer (A). The respectiveproperties are described in detail. As described above, it is preferredthat the polycarbonate-based resin composition of the present inventioninclude only the PC-POS copolymer (A) as a polycarbonate-based resincomponent, and be free of any other polycarbonate-based resin. Asdescribed below, some of the properties of the PC-POS copolymer (A) aremeasured by using the copolymer turned into a molded body. However,those properties result from the very properties of the PC-POS copolymer(A), and are hence described as the properties of the PC-POS copolymer(A).

The flexibility is described in detail. The durometer hardness of thePC-POS copolymer (A) in the polycarbonate-based resin composition of thepresent invention measured with a type D durometer in conformity withJIS K 6253-3:2012 by a method described in Examples is preferably from25 or more to 72 or less, more preferably from 25 or more to 60 or less.

The durometer hardness is an indicator of an indentation hardness. Toobtain a molded body having high flexibility while maintaining somedegree of mechanical strength, the PC-POS copolymer (A) preferably has atype D durometer hardness. The polycarbonate-based resin composition ofthe present invention is excellent in flexibility, and hence can, forexample, be used as a lighting cover without through any packing memberand correspond to a light guide having a complicated shape. Thus, thecomposition can drastically improve ease of construction. Further, evenin the case of an optical member having, in itself, a void structurehaving an undercut draft angle, the member can be integrally molded outof the composition without performance of a step of cutting the insideof the member, and hence may be suitably used in a collimator lens. Themolded body of the composition is excellent in transparency andflexibility, and hence may be suitably used in the followingapplications: home appliance-related applications, such as thesubstrate, light-guiding plate, and housing of a flexible display, awater- and oil-repellent film, an optical adhesive, a switch cover, aheat sealing agent, a water stop material, a sealing agent, a connector,an adapter, and a smartphone cover; optical applications, such as alens, a part for a pair of glasses or sunglasses, and an optical fiberpart; automobile-related applications, such as a cushioning material foran on-vehicle battery, a wiper blade, a convex traffic mirror at a roadcurve, a side mirror, a rearview mirror, a lamp cover, a bumper, awindow, a glass intermediate layer, an exterior material, an interiormaterial, a sound-absorbing material, a steering wheel cover, and asensor cover; commodities, such as a watch part, stationery, a cosmeticcontainer, a water tank for breeding an aquatic organism, a shoe sole, acup, nail art, a toy, a lure, a suction cup, a cooking utensil, such asa steamer, clothes, a silicone wiping sheet, a remote controller cover,an umbrella, and a metal container lining; building material-relatedapplications, such as a building material cover, a door, a window, aglass intermediate layer, a tent, a mirror, a show window case, and aplastic greenhouse; medical applications, such as a medical equipmentcasing, an infusion bag, an infusion tube, a syringe, a baby bottle, amask, a face belt, and a filter part; and other applications, such as adamping part, a robot casing, a drone casing, a shield, a bulletproofshield, a sport cushion, a window for an aircraft, and a resincompatibilizer.

According to one aspect of the present invention, the durometer hardnessof the polycarbonate-based resin composition measured with a type Ddurometer is more preferably 30 or more, still more preferably 40 ormore, and is more preferably 55 or less, still more preferably 50 orless.

A preferred range of the durometer hardness may vary depending on anapplication where the molded body of the present application is used.For example, when the molded body is used in an application whereemphasis is placed on flexibility, the durometer hardness is morepreferably 28 or more, and is more preferably 33 or less. Alternatively,when the molded body is used in an application where emphasis is placedon both of flexibility and mechanical strength, the durometer hardnessis more preferably 45 or more, and is more preferably 50 or less.

According to another aspect of the present invention, the durometerhardness of the polycarbonate-based resin composition measured with atype D durometer is more preferably 30 or more, still more preferably 40or more, and is more preferably 70 or less, still more preferably 68 orless.

For example, when the molded body is used in an application whereemphasis is placed on flexibility, the durometer hardness is morepreferably 28 or more, and is more preferably 33 or less. When themolded body is used in an application where emphasis is placed onmechanical strength, the durometer hardness is more preferably 60 ormore, and is more preferably 65 or less. Alternatively, when the moldedbody is used in an application where emphasis is placed on both offlexibility and mechanical strength, the durometer hardness is morepreferably 45 or more, and is more preferably 50 or less.

The durometer hardness of the molded body cannot be measured in somecases depending on its shape. In such cases, however, the durometerhardness can be measured by: melting the molded body once; and remoldingthe molten product into a shape whose durometer hardness can bemeasured. Molding conditions in such cases are the same as those of amolding method described in Examples.

As a raw material for obtaining such molded body, there may be used aproduct obtained by, for example, cutting, decomposing, or breaking amolded body and a member including the molded body.

The transparency is described in detail. The total light transmittanceof a 2-millimeter thick plate formed of the polycarbonate-based resincomposition of the present invention measured in conformity with JIS K7361-1:1997 is preferably 75% or more. When the total lighttransmittance measured under the conditions is set to 75% or more, thecomposition may be suitably used as any one of the above-mentionedoptically transparent members because of its excellent transparency. Thehigh transparency of the polycarbonate-based resin composition of thepresent invention is derived from the PC-POS copolymer (A), and hencethe transparency is not impaired even when the composition includes thecompound (B).

The total light transmittance of the 2-millimeter thick plate formed ofthe polycarbonate-based resin composition of the present invention ismore preferably 85% or more, still more preferably 89% or more, stillmore preferably 90% or more, still more preferably 91% or more,particularly preferably 92% or more.

The molded body formed of the polycarbonate-based resin composition ofthe present invention may be used as an optical member or a transparentmember. Specifically, the molded body may be suitably used in at leastone selected from, for example, a flexible display, a light-guidingplate, a housing, a water- and oil-repellent film, an optical adhesive,a switch cover, a heat sealing agent, a water stop material, a sealingagent, a connector, an adapter, a smartphone cover, a lens, a part for apair of glasses or sunglasses, an optical fiber part, a cushioningmaterial for an on-vehicle battery, a wiper blade, a convex trafficmirror at a road curve, a side mirror, a rearview mirror, a lamp cover,a bumper, a window, an exterior material, an interior material, asound-absorbing material, a steering wheel cover, a sensor cover, awatch part, stationery, a cosmetic container, a water tank for breedingan aquatic organism, a shoe sole, a cup, nail art, a toy, a lure, asuction cup, a cooking utensil, such as a steamer, clothes, a siliconewiping sheet, a remote controller cover, an umbrella, a metal containerlining, a building material cover, a door, a window, a glassintermediate layer, a tent, a mirror, a show window case, a plasticgreenhouse, a medical equipment casing, an infusion bag, an infusiontube, a syringe, a baby bottle, a mask, a face belt, a filter part, adamping part, a robot casing, a drone casing, a shield, a bulletproofshield, a sport cushion, a window for an aircraft, a resincompatibilizer, a lighting cover, a light guide, a light-guiding panel,a lighting unit, a prism panel, a flat-plate lens, a Fresnel lens, amicrolens array, and a collimator lens.

EXAMPLES

The present invention is more specifically described by way of Examples.However, the present invention is by no means limited by these Examples.In each of Examples, characteristic values and evaluation results weredetermined in the following manner.

(1) Chain Length and Content of Polydimethylsiloxane

The chain length and content of a polydimethylsiloxane were calculatedby NMR measurement from the integrated value ratio of a methyl group ofthe polydimethylsiloxane. In this description, the polydimethylsiloxaneis sometimes abbreviated as PDMS.

<Quantification Method for Chain Length of Polydimethylsiloxane> ¹H-NMRMeasurement Conditions

NMR apparatus: ECA 500 manufactured by JEOL Resonance Co., Ltd.

Probe: 50TH5AT/FG2

Observed range: −5 ppm to 15 ppm

Observation center: 5 ppm

Pulse repetition time: 9 sec

Pulse width: 45°

NMR sample tube: 5φ

Sample amount: 30 mg to 40 mg

Solvent: deuterochloroform

Measurement temperature: room temperature

Number of scans: 256 times

Allylphenol-Terminated Polydimethylsiloxane

A: an integrated value of a methyl group in a dimethylsiloxane moietyobserved around δ −0.02 to δ 0.5

B: an integrated value of a methylene group in allylphenol observedaround δ 2.50 to δ 2.75

Chain length of polydimethylsiloxane=(A/6)/(B/4)

Eugenol-Terminated Polydimethylsiloxane

A: an integrated value of a methyl group in a dimethylsiloxane moietyobserved around δ −0.02 to δ 0.5

B: an integrated value of a methylene group in eugenol observed around δ2.40 to δ 2.70

Chain length of polydimethylsiloxane=(A/6)/(B/4)

<Quantification Method for Content of Polydimethylsiloxane>

Quantification method for the copolymerization amount of apolydimethylsiloxane in a PTBP-terminated polycarbonate obtained bycopolymerizing an allylphenol-terminated polydimethylsiloxane.

NMR apparatus: ECA 500 manufactured by JEOL Resonance Co., Ltd.

Probe: 50TH5AT/FG2

Observed range: −5 ppm to 15 ppm

Observation center: 5 ppm

Pulse repetition time: 9 sec

Pulse width: 45°

Number of scans: 256 times

NMR sample tube: 5φ

Sample amount: 30 mg to 40 mg

Solvent: deuterochloroform

Measurement temperature: room temperature

A: an integrated value of a methyl group in a BPA moiety observed aroundδ 1.5 to δ 1.9

B: an integrated value of a methyl group in a dimethylsiloxane moietyobserved around δ −0.02 to δ 0.3

C: an integrated value of a butyl group in a p-tert-butylphenyl moietyobserved around δ 1.2 to δ 1.4

a=A/6

b=B/6

c=C/9

T=a+b+c

f=a/T×100

g=b/T×100

h=c/T×100

TW=f×254+g×74.1+h×149

PDMS (wt %)=g×74.1/TW×100

<Quantification Method for Amount of Block Represented by Formula (III)>¹³C-NMR Measurement Conditions

NMR apparatus: ECA 500 manufactured by JEOL Resonance Co., Ltd.

Probe: C5HPD/FG probe

Observed range: −25 ppm to 225 ppm

Observation center: 100 ppm

Pulse repetition time: 4 sec

Pulse width: 45°

NMR sample tube: 10φ

Sample amount: 250 mg to 300 mg

Solvent: deuterochloroform

Measurement temperature: room temperature

Number of scans: 10,000 times

The amount of a block represented by the formula (III) is calculatedfrom the area A of the signal peak of the carbonate bond of the blockrepresented by the formula (III), which is detected at 150.9 ppm withrespect to tetramethylsilane (TMS), and the area B of a signal peak at152.1 ppm, which is detected as a result of the overlapping of thesignals of the carbonate bond of a block represented by the formula(I-a) and a block represented by the formula (III-a), in a ¹³C-NMR chartmeasured under the above-mentioned conditions by the calculationexpression “A/(A+B)” (unit: mol %).

The quantification lower limit of the quantification method wascalculated to be less than 0.1 mol % on the basis of the SN ratio of thebaseline of the ¹³C-NMR chart.

wherein R¹, R², R³¹ to R³⁵, X, “a”, “b”, and “t” are as described above.

(2) Viscosity-Average Molecular Weight

A viscosity-average molecular weight (Mv) was calculated from thefollowing equation (Schnell's equation) by using a limiting viscosity[η] determined through the measurement of the viscosity of a methylenechloride solution at 20° C. with an Ubbelohde-type viscometer.

[η]=1.23×10⁻⁵ ×Mv ^(0.83)

(3) Weight-Average Molecular Weight and Molecular Weight Distribution

The weight-average molecular weight (Mw) and molecular weightdistribution (Mw/Mn) of a PC-POS copolymer were measured with ahigh-speed GPC apparatus HLC-8220GPC (manufactured by Tosoh Corporation)under the following conditions, and were calculated on the basis of ageneral-purpose calibration curve produced through use of molecularweight standard samples.

Column temperature: 40° C.

Columns: TSK-GEL GMHXL-L, TSK-GEL G4000HXL, and TSK-GEL G2000HXL(manufactured by Tosoh Corporation)

Mobile phase solvent: Tetrahydrofuran

Flow rate: 1.0 ml/min

Detector: RI

Injection concentration: 10 mg/10 ml

Injection volume: 0.1 ml

Molecular weight standard samples: Polycarbonate 18,050 (manufactured byIdemitsu Kosan Co., Ltd., molecular weight error: ±5%/17,148 to 18,953)and polycarbonate 18,100 (manufactured by Idemitsu Kosan Co., Ltd.,molecular weight error: ±5%/17,200 to 19,100)

(4) Durometer Hardness

The type A durometer hardness of a polycarbonate-based resin compositionwas measured with a rubber hardness meter ESA type (manufactured byElastron, Inc.) and a constant loader EDL-1 (manufactured by Elastron,Inc.) in conformity with JIS K 6253-3:2012 Type A and ISO 7619 Type Aunder a load of 1 kg.

The type D durometer hardness of the polycarbonate-based resincomposition was measured with a rubber hardness meter ESD type(manufactured by Elastron, Inc.) and a constant loader EDL-1 specialtype (with an oil damper, manufactured by Elastron, Inc.) in conformitywith JIS K 6253-3:2012 Type D and ISO 7619 Type D under a load of 5 kg.

(5) Total Light Transmittance

The total light transmittance of a 2-millimeter thick plate formed ofthe polycarbonate-based resin composition was measured with a haze meterNDH 5000 (manufactured by Nippon Denshoku Industries Co., Ltd.) inconformity with JIS K 7361-1:1997.

<Production of Polycarbonate Oligomer>

Sodium dithionite was added in an amount of 2,000 ppm with respect tobisphenol A (BPA) (to be dissolved later) to 5.6 mass % aqueous sodiumhydroxide, and then BPA was dissolved in the mixture so that theconcentration of BPA was 13.5 mass %. Thus, a solution of BPA in aqueoussodium hydroxide was prepared. The solution of BPA in aqueous sodiumhydroxide, methylene chloride, and phosgene were continuously passedthrough a tubular reactor having an inner diameter of 6 mm and a tubelength of 30 m at flow rates of 40 L/hr, 15 L/hr, and 4.0 kg/hr,respectively. The tubular reactor had a jacket portion and thetemperature of the reaction liquid was kept at 40° C. or less by passingcooling water through the jacket. The reaction liquid that had exitedthe tubular reactor was continuously introduced into a baffled vesseltype reactor provided with a sweptback blade and having an internalvolume of 40 L. The solution of BPA in aqueous sodium hydroxide, 25 mass% aqueous sodium hydroxide, water, and a 1 mass % aqueous solution oftriethylamine were further added to the reactor at flow rates of 2.8L/hr, 0.07 L/hr, 17 L/hr, and 0.64 L/hr, respectively, to perform areaction. An aqueous phase was separated and removed by continuouslytaking out the reaction liquid overflowing the vessel type reactor andleaving the reaction liquid at rest. Then, a methylene chloride phasewas collected.

The polycarbonate oligomer thus obtained had a concentration of 341 g/Land a chloroformate group concentration of 0.71 mol/L.

Production Example 1

185 mL of the polycarbonate oligomer solution (PCO) produced asdescribed above, 445 mL of methylene chloride, 40.4 g of an allylphenolterminal-modified polydimethylsiloxane having an average chain length“n” of 37, and 0.104 mL (0.75 mmol) of triethylamine (TEA) were loadedinto a 1-liter separable flask including a baffle board and a mechanicalstirrer with a stirring blade. Aqueous sodium hydroxide A (NaOHaq) (1.9g (47 mmol) of sodium hydroxide and 22 mL of ion-exchanged water)prepared in advance was added to the mixture under stirring to perform areaction between the polycarbonate oligomer and the allylphenolterminal-modified PDMS for 20 minutes. Next, aqueous sodium hydroxide B[BisP-AP (manufactured by Honshu Chemical Industry Co., Ltd.): 4.8 g (16mmol), sodium hydroxide: 2.9 g (73 mmol), ion-exchanged water: 42 mL,sodium hyposulfite (Na₂S₂O₄): 0.006 g (0.038 mmol)] prepared in advancewas further added to the resultant to advance polymerization for 20minutes.

A solution of p-tert-butylphenol (PTBP: manufactured by DIC Corporation)in methylene chloride [solution obtained by dissolving 1.5 g (10.0 mmol)of PTBP in 10 mL of methylene chloride] and a solution C of BPA inaqueous sodium hydroxide [solution obtained by dissolving 3.0 g (10mmol) of bisphenol A, 5.2 g (131 mmol) of NaOH, and 0.006 g (0.038 mmol)of Na₂S₂O₄ in 77 mL of ion-exchanged water] were added to the resultantpolymerization liquid to perform a polymerization reaction for 20minutes.

After the completion of the polymerization, the reaction liquid wastransferred to a separating funnel and left at rest to be separated intoan organic phase and an aqueous phase. After that, the organic layer wastransferred to another separating funnel. The organic layer wassequentially washed with 100 mL of 0.03 mol/L aqueous NaOH and 100 mL of0.2 mol/L hydrochloric acid, and was then repeatedly washed withion-exchanged water until an electric conductivity in an aqueous phaseafter the washing became 10 μS/m or less.

The organic layer obtained after the washing was transferred to a vatand dried with an explosion-proof dryer (under a nitrogen atmosphere) at48° C. overnight to provide a sheet-shaped PC-POS copolymer. Thesheet-shaped PC-POS copolymer was cut to provide a flaky PC-POScopolymer (a2). Details about the PC-POS copolymer are shown in Table1-1.

Production Example 2

A PC-POS copolymer (a10) was obtained by performing production in thesame manner as in Production Example 1 except that: 43.0 g of anallylphenol terminal-modified polydimethylsiloxane having an averagechain length “n” of 23 was used as an allylphenol terminal-modifiedpolydimethylsiloxane; a solution obtained by dissolving 3.7 g (94 mmol)of NaOH in 43 mL of ion-exchanged water was used as the aqueous sodiumhydroxide A; a mixture of 5.5 g (19 mmol) of BisP-AP (manufactured byHonshu Chemical Industry Co., Ltd.), 2.3 g (57 mmol) of NaOH, 33 mL ofion-exchanged water, and 0.031 g (0.196 mmol) of Na₂S204 was used as theaqueous sodium hydroxide B; and a solution obtained by dissolving 2.5 g(8.7 mmol) of bisphenol A, 1.9 g (46.3 mmol) of NaOH, and 0.031 g (0.196mmol) of Na₂S₂O₄ in 27 mL of ion-exchanged water was used as thesolution C of BPA in aqueous sodium hydroxide. Details about the PC-POScopolymer are shown in Table 1-1.

Production Example 3

A PC-POS copolymer (a14) was obtained by performing production in thesame manner as in Production Example 1 except that: 46.0 g of anallylphenol terminal-modified polydimethylsiloxane having an averagechain length “n” of 63 was used as an allylphenol terminal-modifiedpolydimethylsiloxane; a solution obtained by dissolving 2.2 g (55.9mmol) of NaOH in 26 mL of ion-exchanged water was used as the aqueoussodium hydroxide A; a mixture of 5.8 g (20 mmol) of BisP-AP(manufactured by Honshu Chemical Industry Co., Ltd.), 2.4 g (60 mmol) ofNaOH, 35 mL of ion-exchanged water, and 0.031 g (0.196 mmol) of Na₂S₂O₄was used as the aqueous sodium hydroxide B; and a solution obtained bydissolving 6.6 g (22.6 mmol) of bisphenol A, 3.2 g (80.9 mmol) of NaOH,and 0.031 g (0.196 mmol) of Na₂S₂O₄ in 47 mL of ion-exchanged water wasused as the solution C of BPA in aqueous sodium hydroxide. Details aboutthe PC-POS copolymer are shown in Table 1-1.

Production Example 4

A PC-POS copolymer (a3) was obtained by performing production in thesame manner as in Production Example 1 except that: the amount of theallylphenol terminal-modified polydimethylsiloxane was set to 62.0 g; asolution obtained by dissolving 3.1 g (77 mmol) of NaOH in 35 mL ofion-exchanged water was used as the aqueous sodium hydroxide A; asolution obtained by dissolving 6.0 g (21 mmol) of BisP-AP, 2.5 g (62mmol) of NaOH, and 0.031 g (0.20 mmol) of Na₂S₂O₄ in 36 mL ofion-exchanged water was used as the aqueous sodium hydroxide B; and asolution obtained by dissolving 4.0 g (14 mmol) of bisphenol A, 2.3 g(58 mmol) of NaOH, and 0.031 g (0.20 mmol) of Na₂S₂O₄ in 34 mL ofion-exchanged water was used as the solution C of BPA in aqueous sodiumhydroxide. Details about the PC-POS copolymer are shown in Table 1-1.

Production Example 5

A PC-POS copolymer (a5) was obtained by performing production in thesame manner as in Production Example 1 except that: the amount of theallylphenol terminal-modified polydimethylsiloxane was set to 96.0 g; asolution obtained by dissolving 4.0 g (100 mmol) of NaOH in 46 mL ofion-exchanged water was used as the aqueous sodium hydroxide A; asolution obtained by dissolving 7.7 g (27 mmol) of BisP-AP, 4.7 g (118mmol) of NaOH, and 0.031 g (0.20 mmol) of Na₂S₂O₄ in 69 mL ofion-exchanged water was used as the aqueous sodium hydroxide B; and thesolution C of BPA in aqueous sodium hydroxide was not added. Detailsabout the PC-POS copolymer are shown in Table 1-1.

Production Example 6

A PC-POS copolymer (a9) was obtained by performing production in thesame manner as in Production Example 1 except that: the amount of theallylphenol terminal-modified polydimethylsiloxane was set to 4.0 g; asolution obtained by dissolving 1.5 g (38 mmol) of NaOH in 18 mL ofion-exchanged water was used as the aqueous sodium hydroxide A; 1.8 g(12.0 mmol) of PTBP was used; a solution obtained by dissolving 13.2 g(45 mmol) of bisphenol A, 6.3 g (159 mmol) of NaOH, and 0.031 g (0.20mmol) of Na₂S₂O₄ in 93 mL of ion-exchanged water was used as thesolution C of BPA in aqueous sodium hydroxide; and the aqueous sodiumhydroxide B was not loaded. Details about the PC-POS copolymer are shownin Table 1-2.

Production Example 7

A PC-POS copolymer (a12) was obtained by performing production in thesame manner as in Production Example 1 except that: the amount of theallylphenol terminal-modified polydimethylsiloxane was set to 23.0 g; asolution obtained by dissolving 2.0 g (50.8 mmol) of NaOH in 23 mL ofion-exchanged water was used as the aqueous sodium hydroxide A; 1.8 g(12.0 mmol) of PTBP was used; a solution obtained by dissolving 11.7 g(40.4 mmol) of bisphenol A, 5.8 g (146.0 mmol) of NaOH, and 0.031 g(0.20 mmol) of Na₂S₂O₄ in 85 mL of ion-exchanged water was used as thesolution C of BPA in aqueous sodium hydroxide; and the aqueous sodiumhydroxide B was not loaded. Details about the PC-POS copolymer are shownin Table 1-2.

Production Example 8

A PC-POS copolymer (a13) was obtained by performing production in thesame manner as in Production Example 1 except that: the amount of theallylphenol terminal-modified polydimethylsiloxane was set to 55 g; asolution obtained by dissolving 2.9 g (72.1 mmol) of NaOH in 33 mL ofion-exchanged water was used as the aqueous sodium hydroxide A; 1.8 g(12.0 mmol) of PTBP was used; a solution obtained by dissolving 9.3 g(32.0 mmol) of bisphenol A, 5.0 g (124.7 mmol) of NaOH, and 0.031 g(0.20 mmol) of Na₂S₂O₄ in 73 mL of ion-exchanged water was used as thesolution C of BPA in aqueous sodium hydroxide; and the aqueous sodiumhydroxide B was not loaded. Details about the PC-POS copolymer are shownin Table 1-2.

Production Example 9

A PC-POS copolymer (a7) was obtained by performing production in thesame manner as in Production Example 1 except that: the amount of theallylphenol terminal-modified polydimethylsiloxane was set to 78.0 g; asolution obtained by dissolving 3.5 g (87 mmol) of NaOH in 40 mL ofion-exchanged water was used as the aqueous sodium hydroxide A; 1.8 g(12.0 mmol) of PTBP was used; a solution obtained by dissolving 7.5 g(26 mmol) of bisphenol A, 4.4 g (109 mmol) of NaOH, and 0.031 g (0.20mmol) of Na₂S₂O₄ in 70 mL of ion-exchanged water was used as thesolution C of BPA in aqueous sodium hydroxide; and the aqueous sodiumhydroxide B was not loaded. Details about the PC-POS copolymer are shownin Table 1-2.

TABLE 1-1 Production Example 1 2 3 4 5 Amount of PDMS in PC-POS mass %40 41 42 50 62 copolymer (A) Amount of BPA block*¹ in PC mass % 92.292.8 90.0 90.9 95.0 block (A-1) PC block (A-1) except BPA*² BisP- BisP-BisP- BisP- BisP- AP AP AP AP AP Amount of PC block except BPA*² mass %5 4 5 5 2 in PC-POS copolymer (A) Amount of block represented by mol %<0.1 <0.1 <0.1 <0.1 <0.1 formula (III) in PC-POS copolymer (A) PDMSchain length 37 23 63 37 37 Mv 20,000 17,900 20,500 19,200 19,400 Mw28,000 — — — 34,400 Molecular weight distribution 2.5 — — — 2.8 (Mw/Mn)PC-POS copolymer a2 a10 a14 a3 a5 *1: BPA block: The block represents aPC block derived from BPA. *2: PC block except BPA: The block representsa PC block derived from a dihydric phenol except BPA.

TABLE 1-2 Production Example 6 7 8 9 Amount of PDMS mass % 6 25 45 55 inPC-POS copolymer (A) Amount of BPA mass % 100 100 100 100 block*¹ in PCblock (A-1) PC block (A-1) — — — — except BPA*² Amount of PC block mass% — — — — except BPA*² in PC-POS copolymer (A) Amount of block mol %<0.1 <0.1 <0.1 <0.1 represented by formula (III) in PC- POS copolymer(A) PDMS chain length 37 37 37 37 Mv 17,700 17,600 17,500 16,500 Mw —20,700 24,700 36,700 Molecular weight — 2.3 2.6 2.9 distribution (Mw/Mn)PC-POS copolymer a9 a12 a13 a7 *¹BPA block: The block represents a PCblock derived from BPA. *²PC block except BPA: The block represents a PCblock derived from a dihydric phenol except BPA.

Examples 1 to 49 and Comparative Examples 1 to 3

The PC-POS copolymers (A) obtained in the respective production examplesand the respective compounds (B) shown in Tables 3 to 7 weremelt-kneaded and pelletized to provide resin compositions. Each of theresin compositions was molded with a vacuum pressing machine(manufactured by Imoto Machinery Co., Ltd., manual hydraulic vacuum heatpressing machine). 7.0 g of the resin composition was loaded into a moldmeasuring 5 cm long by 5 cm wide by 2 mm thick, and surfaces in contactwith the resin composition were sandwiched between mirror-finishedaluminum plates. The resultant was loaded into the vacuum pressingmachine, and a pressure in the vessel of the vacuum pressing machine wasreduced to −0.1 MPa or less with respect to atmospheric pressure. Afterthat, the resultant was heated until its temperature reached a moldingtemperature shown in each of Table 2-1 and Table 2-2 in accordance withthe PC-POS copolymer (A) in each resin composition. After thetemperature had reached the molding temperature, the pressing pressurewas set to 2 MPa, and then the resultant was heated for 2 minutes.Subsequently, the pressing pressure was increased over 3 minutes, andthe molding was performed for 5 minutes while the pressure wasmaintained at 15 MPa. After the molding, the pressure was returned toatmospheric pressure, and then the molded body was removed, followed byits cooling to room temperature. After that, the cooled molded body waspeeled from the mirror-finished aluminum plates to provide a sample formeasurement measuring 5 cm long by 5 cm wide by 2 mm thick. Theevaluation results of the polycarbonate-based resin compositions areshown in Tables 3 to 7.

TABLE 2-1 PC-POS copolymer a2 a10 a14 a3 a5 Molding temperature (° C.)of sample 280 280 280 280 280 for measurement of durometer hardnessDurometer hardness 63 60 51 47 29 Type D Durometer hardness 95< 95< 95<95< 78 Type A Molding temperature (° C.) of 180 230 230 180 180 samplefor measurement of total light transmittance Total light transmittance(%) 90.8 91.2 81.2 91.4 91.7

TABLE 2-2 PC-POS copolymer a12 a13 a7 a9 Molding temperature (° C.) ofsample for 280 280 280 280 measurement of durometer hardness Durometerhardness 71 57 28 74 Type D Durometer hardness 95< 95< 74 95< Type AMolding temperature (° C.) of sample for 280 280 280 180 measurement oftotal light transmittance Total light transmittance (%) 90.3 90.9 92.388.9

TABLE 3 Example Unit 1 2 3 4 5 6 7 8 9 PC-POS a13 Part(s) 100 100 100100 100 100 copolymer a7 by 100 100 (A) a5 mass 100 a14 a10 a3 a9 a12 a2Compound Antioxidant Irgafos 0.02 0.05 0.1 0.05 0.1 0.1 (B) 168Doverphos 0.05 0.05 S9228PC PEP-36 0.03 Inganox 0.02 1076 Durometerhardness 57 57 57 57 57 57 28 28 29 Type D Durometer hardness 95< 95<95< 95< 95< 95< 74 74 78 Type A Total light % 91 91 91 91 91 91 92 92 92transmittance Comparative Example Example 10 11 12 13 14 1 PC-POS a13copolymer a7 (A) a5 a14 100 a10 100 a3 100 a9 100 a12 100 a2 100Compound Antioxidant Irgafos 0.1 0.1 0.1 0.1 0.1 0.1 (B) 168 DoverphosS9228PC PEP-36 Inganox 1076 Durometer hardness 51 60 47 71 63 74 Type DDurometer hardness 95< 95< 95< 95< 95< 95< Type A Total light 81 91 9190 91 89 transmittance

TABLE 4 Example Example Unit 15 16 17 18 PC-POS a13 Part(s) 100 100 100100 copolymer a7 by (A) a5 mass a14 a10 a3 a9 a12 a2 CompoundAntioxidant Irgafos 168 0.1 0.1 0.1 0.1 (B) Doverphos S9228PC PEP-36Inganox 1076 Dye Macrolex Blue 0.00001 Macrolex Violet 0.0001 ReleaseRIKEMAL S-100A 0.03 agent RIKESTER 0.1 EW-440A Durometer hardness 57 5757 57 Type D Durometer hardness 95< 95< 95< 95< Type A Total light % 9090 91 91 transmittance (%)

TABLE 5 Example Unit 19 20 21 22 23 24 25 26 PC-POS a13 Part(s) 100 100100 100 100 100 copolymer a7 by 100 (A) a5 mass 100 a14 a10 a3 a9 a12 a2Compound Antioxidant Irgafos 168 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 (B)JC263 UV absorber UV-3638F 0.15 SEESORB 709 0.3 0.3 0.3 KEMISORB 0.3 279Tinuvin 234 0.4 Tinuvin 1577 0.3 Hostavin B- 0.3 CAP Silicone- KR-511based compound Release RIKEMAL agent S-100A Durometer hardness 57 57 5757 57 57 28 29 Type D Durometer hardness 95< 95< 95< 95< 95< 95< 74 78Type A Total light transmittance % 91 91 91 91 91 91 92 92 ComparativeExample Example 27 28 29 30 31 32 2 PC-POS a13 100 copolymer a7 (A) a5a14 100 a10 100 a3 100 a9 100 a12 100 a2 100 Compound AntioxidantIrgafos 168 0.1 0.1 0.1 0.03 0.1 0.1 0.1 (B) JC263 0.02 UV absorberUV-3638F 0.15 SEESORB 709 0.3 0.3 0.3 0.3 0.3 0.3 KEMISORB 279 Tinuvin234 Tinuvin 1577 Hostavin B- CAP Silicone- KR-511 0.1 based compoundRelease RIKEMAL 0.03 agent S-100A Durometer hardness 51 60 47 57 71 6374 Type D Durometer hardness 95< 95< 95< 95< 95< 95< 95< Type A Totallight transmittance 81 91 91 91 90 91 89

TABLE 6 Example Unit 33 34 35 36 37 38 39 40 PC-POS a13 Part(s) 100 100100 copolymer a7 by 100 (A) a5 mass 100 a14 100 a10 100 a3 100 a9 a12 a2Compound Antioxidant Irgafos 168 0.03 (B) Doverphos 0.05 0.05 0.05 0.050.05 0.02 0.1 S9228PC Inganox 1076 0.07 Epoxy CELLOXIDE 0.02 0.02 0.020.02 0.02 0.01 0.1 0.02 compound 2021P Silicone- KR-511 0.1 basedcompound Polyether UNILUBE 0.8 50DE-25R Release RIKEMAL 0.03 0.03 0.03agent S-100A Durometer hardness 28 29 51 60 47 57 57 56 Type D Durometerhardness 74 78 95< 95< 95< 95< 95< 95< Type A Total light transmittance% 92 92 81 91 91 91 91 92 (%) Comparative Example Example Example 41 4243 3 44 45 PC-POS a13 100 100 100 copolymer a7 (A) a5 a14 a10 a3 a9 100a12 100 a2 100 Compound Antioxidant Irgafos 168 0.03 (B) Doverphos 0.10.05 0.05 0.05 0.05 S9228PC Inganox 1076 Epoxy CELLOXIDE 0.02 0.02 0.020.02 compound 2021P Silicone- KR-511 0.05 0.05 0.05 based compoundPolyether UNILUBE 0.8 50DE-25R Release RIKEMAL agent S-100A Durometerhardness 56 71 63 74 57 57 Type D Durometer hardness 95< 95< 95< 95< 95<95< Type A Total light transmittance 92 90 91 89 91 91 (%)

TABLE 7 Example Unit 46 47 48 49 PC-POS a13 Part(s) 100 100 100 100copolymer a7 by (A) a5 mass a14 a10 a3 a9 a12 a2 Compound Anti- Irgafos0.1 0.1 0.1 0.1 (B) oxidant 168 Light- TSR9002 0.4 2 agent MBX-5 0.4diffusing Flame KFBS 0.08 retardant Durometer hardness 57 57 57 57 TypeD Durometer hardness 95< 95< 95< 95< Type A Total light % 89 60 48 80transmittance

Compound (B) <Antioxidant>

Irgafos 168: tris(2,4-di-tefrtbutylphenyl)phosphite; manufactured byBASF Japan Ltd.

Doverphos S9228PC: bis(2,4-dicumylphenyl)pentaerythritol diphosphite, Nacontent: 50 mass % or less; manufactured by Dover Chemical Co.

PEP-36:bis-(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol-diphosphite;manufactured by ADEKA Corporation

Irganox 1076:n-octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate;manufactured by ADEKA Corporation

JC263: triphenylphosphine; manufactured by Johoku Chemical Co., Ltd.

<Dye>

MACROLEX Blue RR; manufactured by LANXESS

MACROLEX Violet B; manufactured by LANXESS

<Release Agent>

RIKEMAL 5-100A: stearic acid monoglyceride; manufactured by RikenVitamin Co., Ltd.

RIKESTER EW-440A: pentaerythritol tetrastearate, manufactured by RikenVitamin Co., Ltd.

<UV Absorber>

Cyasorb UV-3638F: (2,2′-(1,4-phenylene)bis[4H-3,1-benzoxazin-4-one];manufactured by Cytec Industries Inc.

SEESORB 709: 2-(2′-hydroxy-5′-tert-octylphenyl)benzotriazole;manufactured by Shipro Kasei Kaisha, Ltd.

KEMISORB 279:2,2′-methylenebis(6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol);manufactured by Chemipro Kasei Kaisha, Ltd.

Tinuvin 234:2-[2′-hydroxy-3′,5′-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole;manufactured by BASF Japan Ltd.

Tinuvin 1577: 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol;manufactured by BASF Japan Ltd.

Hostavin B-CAP: p-phenylenebis(methylenemalonic acid) tetraethyl ester;manufactured by Clariant Chemicals K.K.

<Flame Retardant>

KFBS: potassium perfluorobutanesulfonate; manufactured by MitsubishiMaterials Electronic Chemicals Co., Ltd.

<Polyether Compound>

UNILUBE 50DE-25R: polyoxyethylene-polyoxypropylene-bisphenol A ether;manufactured by NOF Corporation

<Silicone-Based Compound>

KR-511: reactive silicone compound; manufactured by Shin-Etsu ChemicalCo., Ltd., containing a phenyl group, a methoxy group, and a vinylgroup, refractive index=1.518

<Epoxy Compound>

CELLOXIDE 2021P:3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexanecarboxylate

<Light-Diffusing Agent>

TSR9002 (product name): bead-shaped crosslinked silicone, averageparticle diameter: 2 μm; manufactured by Momentive Performance MaterialsJapan LLC

MBX-5 (product name): bead-shaped crosslinked acrylic particles, averageparticle diameter: 5 μm; manufactured by Sekisui Kasei Co., Ltd.

INDUSTRIAL APPLICABILITY

According to the present invention, the polycarbonate-based resincomposition having both of excellent flexibility and transparency can beprovided. The molded body formed of the polycarbonate-based resincomposition of the present invention may be used as an opticallytransparent member. Specifically, the molded body may be suitably usedin at least one selected from, for example, a flexible display, alight-guiding plate, a housing, a water- and oil-repellent film, anoptical adhesive, a switch cover, a heat sealing agent, a water stopmaterial, a sealing agent, a connector, an adapter, a smartphone cover,a lens, a part for a pair of glasses or sunglasses, an optical fiberpart, a cushioning material for an on-vehicle battery, a wiper blade, aconvex traffic mirror at a road curve, a side mirror, a rearview mirror,a lamp cover, a bumper, a window, an exterior material, an interiormaterial, a sound-absorbing material, a steering wheel cover, a sensorcover, a watch part, stationery, a cosmetic container, a water tank forbreeding an aquatic organism, a shoe sole, a cup, nail art, a toy, alure, a suction cup, a cooking utensil, such as a steamer, clothes, asilicone wiping sheet, a remote controller cover, an umbrella, a metalcontainer lining, a building material cover, a door, a window, a glassintermediate layer, a tent, a mirror, a show window case, a plasticgreenhouse, a medical equipment casing, an infusion bag, an infusiontube, a syringe, a baby bottle, a mask, a face belt, a filter part, adamping part, a robot casing, a drone casing, a shield, a bulletproofshield, a sport cushion, a window for an aircraft, a resincompatibilizer, a lighting cover, a light guide, a light-guiding panel,a lighting unit, a prism panel, a flat-plate lens, a Fresnel lens, amicrolens array, and a collimator lens.

1. A polycarbonate-based resin composition, comprising: apolycarbonate-polyorganosiloxane copolymer (A); and at least one kind ofcompound (B) selected from the group consisting of an antioxidant, adye, a release agent, a light-diffusing agent, a flame retardant, a UVabsorber, a silicone-based compound, an epoxy compound, and a polyethercompound, wherein the polycarbonate-polyorganosiloxane copolymer (A)contains a polycarbonate block (A-1) comprising a repeating unitrepresented by the following general formula (I) and apolyorganosiloxane block (A-2) containing a repeating unit representedby the following general formula (II), and satisfies the followingrequirements (1) to (3): (1) a content of the polyorganosiloxane block(A-2) is from more than 40 mass % to 70 mass % or less; (2) thecopolymer has a viscosity-average molecular weight of from 10,000 ormore to 23,000 or less; and (3) the copolymer contains, as thepolycarbonate block (A-1), such a polycarbonate block that in thefollowing general formula (I), “a” and “b” each represent 0, and Xrepresents an isopropylidene group:

wherein R¹ and R² each independently represent a halogen atom, an alkylgroup having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6carbon atoms, X represents a single bond, an alkylene group having 1 to8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, acycloalkylene group having 5 to 15 carbon atoms, an arylene group having6 to 12 carbon atoms, a cycloalkylidene group having 5 to 15 carbonatoms, a fluorenediyl group, an arylalkylene group having 7 to 15 carbonatoms, an arylalkylidene group having 7 to 15 carbon atoms, —S—, —SO—,—SO₂—, —O—, or —CO—, R³ and R⁴ each independently represent a hydrogenatom, a halogen atom, an alkyl group having 1 to 6 carbon atoms, analkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12carbon atoms, and “a” and “b” each independently represent an integer offrom 0 to
 4. 2. A polycarbonate-based resin composition, comprising: apolycarbonate-polyorganosiloxane copolymer (A); and at least one kind ofcompound (B) selected from the group consisting of an antioxidant, adye, a release agent, a light-diffusing agent, a flame retardant, a UVabsorber, a silicone-based compound, an epoxy compound, and a polyethercompound, wherein the polycarbonate-polyorganosiloxane copolymer (A)contains a polycarbonate block (A-1) comprising a repeating unitrepresented by the following general formula (I) and apolyorganosiloxane block (A-2) containing a repeating unit representedby the following general formula (II), and wherein the followingrequirements (1) to (3) are satisfied: (1) a content of thepolyorganosiloxane block (A-2) in the polycarbonate-based resincomposition is from 25 mass % or more to 70 mass % or less; (2) thepolycarbonate-polyorganosiloxane copolymer (A) has a viscosity-averagemolecular weight of from 10,000 or more to 23,000 or less; and (3) thecopolymer contains, as the polycarbonate block (A-1), such apolycarbonate block that in the following general formula (I), “a” and“b” each represent 0, and X represents an isopropylidene group:

wherein R¹ and R² each independently represent a halogen atom, an alkylgroup having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6carbon atoms, X represents a single bond, an alkylene group having 1 to8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, acycloalkylene group having 5 to 15 carbon atoms, an arylene group having6 to 12 carbon atoms, a cycloalkylidene group having 5 to 15 carbonatoms, a fluorenediyl group, an arylalkylene group having 7 to 15 carbonatoms, an arylalkylidene group having 7 to 15 carbon atoms, —S—, —SO—,—SO₂—, —O—, or —CO—, R³ and R⁴ each independently represent a hydrogenatom, a halogen atom, an alkyl group having 1 to 6 carbon atoms, analkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12carbon atoms, and “a” and “b” each independently represent an integer offrom 0 to
 4. 3. The polycarbonate-based resin composition according toclaim 2, wherein the polycarbonate-based resin composition comprises0.001 part by mass to 0.5 part by mass of the antioxidant, 0.00001 partby mass to 0.05 part by mass of the dye, 0.001 part by mass to 0.5 partby mass of the release agent, 0.1 part by mass to 5 parts by mass of thelight-diffusing agent, 0.001 part by mass to 20 parts by mass of theflame retardant, 0.01 part by mass to 1 part by mass of the UV absorber,0.01 part by mass to 0.25 part by mass of the silicone-based compound, 0parts by mass to 0.2 part by mass of the epoxy compound, and/or 0.2 partby mass to 1 part by mass of the polyether compound with respect to 100parts by mass of the polycarbonate-polyorganosiloxane copolymer (A). 4.The polycarbonate-based resin composition according to claim 2, whereina content of a unit represented by the following general formula (III)in the polyorganosiloxane block (A-2) is 0.1 mol % or less:

wherein R³³ and R³⁴ each independently represent a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms, R³¹ represents an alkylene group having 1 to 8 carbon atoms, analkylidene group having 2 to 8 carbon atoms, a cycloalkylene grouphaving 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15carbon atoms, an arylene group having 6 to 12 carbon atoms, afluorenediyl group, an arylalkylene group having 7 to 15 carbon atoms,or an arylalkylidene group having 7 to 15 carbon atoms, R³⁵ represents ahydrogen atom, a halogen atom, an alkyl group having 1 to 6 carbonatoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl grouphaving 6 to 12 carbon atoms, and “t” represents an average chain lengthof the polyorganosiloxane.
 5. The polycarbonate-based resin compositionaccording to claim 2, wherein the polyorganosiloxane block (A-2) has anumber of repetitions of from 10 or more to less than
 90. 6. Thepolycarbonate-based resin composition according to claim 5, wherein thepolyorganosiloxane block (A-2) has a number of repetitions of from 10 ormore to or less.
 7. The polycarbonate-based resin composition accordingto claim 2, wherein the polycarbonate-polyorganosiloxane copolymer (A)has a molecular weight distribution Mw/Mn of from 2.1 or more to 3.9 orless.
 8. The polycarbonate-based resin composition according to claim 2,wherein the polycarbonate-polyorganosiloxane copolymer (A) has aweight-average molecular weight of 40,000 or less.
 9. Thepolycarbonate-based resin composition according to claim 2, wherein thepolyorganosiloxane block (A-2) contains a unit represented by at leastone of the following general formulae (II-I) to (II-III):

wherein R³ to R⁶ each independently represent a hydrogen atom, a halogenatom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and aplurality of R³, R⁴, R⁵, or R⁶ may be identical to or different fromeach other, Y represents —R⁷O—, —R⁷COO—, —R⁷NH—, —R⁷NR⁸—, —COO—, —S—,—R⁷COO—R⁹—O—, or —R⁷O—R¹⁰—O—, and a plurality of Y may be identical toor different from each other, the R⁷ represents a single bond, a linear,branched, or cyclic alkylene group, an aryl-substituted alkylene group,a substituted or unsubstituted arylene group, or a diarylene group, R⁸represents an alkyl group, an alkenyl group, an aryl group, or anaralkyl group, R⁹ represents a diarylene group, R¹⁰ represents a linear,branched, or cyclic alkylene group, or a diarylene group, β represents adivalent group derived from a diisocyanate compound, or a divalent groupderived from a dicarboxylic acid or a halide of a dicarboxylic acid, “n”represents a chain length of the polyorganosiloxane, n-1, and “p” and“q” each represent an integer of 1 or more representing the number ofrepetitions of a polyorganosiloxane unit, and a sum of “p” and “q” isn-2.
 10. The polycarbonate-based resin composition according to claim 2,wherein the polyorganosiloxane block (A-2) contains a unit representedby the following general formula (V):

wherein R³ to R⁶ and n-1 are identical to those described in the generalformulae (II-I) to (II-III), and R¹⁵ represents a hydrogen atom, ahalogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy grouphaving 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbonatoms.
 11. The polycarbonate-based resin composition according to claim2, wherein a 2-millimeter thick plate formed of the polycarbonate-basedresin composition has a total light transmittance of 75% or more, whichis measured in conformity with JIS K 7361-1:1997.
 12. Thepolycarbonate-based resin composition according to claim 2, wherein thepolycarbonate-based resin composition has a durometer hardness of from25 or more to 72 or less, which is measured with a type D durometer inconformity with JIS K 6253-3:2012.
 13. The polycarbonate-based resincomposition according to claim 2, wherein the polycarbonate-based resincomposition has a durometer hardness of from 25 or more to 60 or less,which is measured with a type D durometer in conformity with JIS K6253-3:2012.
 14. The polycarbonate-based resin composition according toclaim 2, wherein the content of the polyorganosiloxane block (A-2) inthe resin composition is from more than 40 mass % to 70 mass % or less.15. The polycarbonate-based resin composition according to claim 2,wherein the polycarbonate-based resin composition is free of apolycarbonate-based resin except the polycarbonate-polyorganosiloxanecopolymer (A).